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Intelligent control sectional type adhesive tape die cutting process

An intelligent control and segmented technology, applied in metal processing, vibration suppression adjustment, spring/shock absorber, etc., can solve the problems of tape die-cutting process adaptation width and cumbersome die-cutting, etc., to reduce power requirements and The number of required control devices, the number of motors are reduced, and the effect of improving die-cutting efficiency

Pending Publication Date: 2022-03-18
苏州思立达电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an intelligently controlled segmented tape die-cutting process to solve the cumbersome problem of the tape die-cutting process proposed in the above background technology in adapting the width and die-cutting

Method used

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  • Intelligent control sectional type adhesive tape die cutting process
  • Intelligent control sectional type adhesive tape die cutting process
  • Intelligent control sectional type adhesive tape die cutting process

Examples

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them.

[0027] see Figure 1-7 , an embodiment provided by the present invention: an intelligently controlled segmented tape die-cutting process, including die-cutting position adjustment, tape conveying, segmental die-cutting and adhesive tape fixing, the tape die-cutting process includes tape Die-cutting device, adhesive tape die-cutting device comprises first support frame 2, second support frame 3 and transmission screw rod 5, and first support frame 2 and second support frame 3 all comprise die-cutting tool 13 and the first The fixed plate 11, the second transmission rod 10 and the first transmission rod 9, the second transmission bevel gear 8 can be drive...

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Abstract

The invention discloses an intelligent control sectional type adhesive tape die cutting process, relates to the technical field of die cutting, and aims to solve the problem that an existing adhesive tape die cutting process is relatively tedious in width adaptation and die cutting. The adhesive tape die cutting device comprises a first supporting frame, a second supporting frame and a transmission threaded rod, the first supporting frame and the second supporting frame each comprise a die cutting tool, a first fixing plate, a second transmission rod and a first transmission rod, the first fixing plates, the second transmission rods and the first transmission rods are arranged at the upper ends of the die cutting tools, and a second transmission bevel gear can be driven by the transmission threaded rod to rotate. The rotation of the second transmission bevel gear can drive the die cutting tool to longitudinally move back and forth to conduct die cutting on the adhesive tape, the first supporting frame and the second supporting frame can conduct segmented die cutting on the two sides of the adhesive tape at the same time, and a second fixing plate is arranged on one side of the outer portion of the first supporting frame and one side of the outer portion of the second supporting frame. And fourth transmission bevel gears are arranged on the two sides of the exterior of the second fixing plate.

Description

technical field [0001] The invention relates to the technical field of die-cutting, in particular to an intelligently controlled segmented adhesive tape die-cutting process. Background technique [0002] Tape can be divided into high temperature tape, double-sided tape, insulating tape, special tape, pressure sensitive tape, die-cutting tape according to its function. Different functions are suitable for different industry needs. People design a tape for die-cutting tape Die-cutting process, tape die-cutting process is the most commonly used process for packaging tapes. It is to use a die-cutter to form a die-cutting plate according to the pattern required by the product design. Under the action of pressure, the tape or other plate blanks are rolled and cut. Forming process into desired shape or cut marks. [0003] However, when the existing tape die-cutting process die-cuts the tape, the tape cannot be die-cut normally when the width of the tape is long, and it is necessar...

Claims

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Application Information

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IPC IPC(8): B26F1/38B26D7/01B26D7/12B26D7/00F16F15/067
CPCB26F1/38B26D7/018B26D7/12B26D7/00F16F15/067
Inventor 陈章国韩帅帅
Owner 苏州思立达电子有限公司
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