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Exposure method of double-tabletop LDI system

An exposure method, double-stage technology, applied in the exposure field of double-stage LDI system, can solve the problem of unusable inner layer board

Pending Publication Date: 2022-03-25
HANGZHOU XINNUO MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in practical applications, the exposure patterns on the front and back surfaces of the inner layer board often cannot be completely accurately aligned and there is a certain deviation. When the deviation is too large, it will directly cause the inner layer board to be unusable.

Method used

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  • Exposure method of double-tabletop LDI system
  • Exposure method of double-tabletop LDI system

Examples

Experimental program
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Embodiment Construction

[0040] In this application, in order to improve the processing efficiency of exposing the two surfaces of the inner layer board, on the basis of two LDI machines, each LDI machine is equipped with two exposure tables for placing the inner layer board. Then, for each LDI machine, after the surface graphic exposure of the inner layer board on one exposure table is completed, the graphic exposure of the inner layer board on the other exposure table can be performed immediately, without the need to complete the surface pattern of an inner layer board After the graphic exposure, wait for the transplanter to remove the inner layer board, and then perform the steps of new inner layer board operation on the exposure table before proceeding to the next inner layer board exposure processing; The inner board on the table is processed, and at the same time, the transplanter performs operations such as loading and unloading on another exposure table, thereby reducing the waiting time of the...

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Abstract

The invention discloses an exposure method of a double-table-board LDI system, the double-table-board LDI system comprises a first LDI machine and a second LDI machine, each LDI machine comprises two exposure table boards, and the exposure method comprises the following steps: the first LDI machine exposes a first surface of an inner layer plate and marks a second surface of the inner layer plate to form marking points; the first LDI machine and the second LDI machine are used for interactively transmitting first exposure table top information of the inner layer plate on the first LDI machine; the second LDI machine determines the exposure compensation amount through the first exposure table top information, the size parameters of the inner layer plate and the second exposure table top information, and determines the exposure position of the second surface of the inner layer plate based on the marking point; and the second LDI machine exposes the second surface of the inner layer plate according to the exposure position and the exposure compensation amount. The exposure engines between the two LDI machines are subjected to information interaction, so that the exposure layer deviation of the upper surface and the lower surface of the inner layer plate is reduced, and the exposure precision of the inner layer plate is improved.

Description

technical field [0001] The present invention relates to the technical field of LDI exposure, in particular to an exposure method of a dual-table LDI system. Background technique [0002] The current PCB circuit board is developing towards high multi-layer, and the demand for inner layer board is increasing. The inner layer board refers to the circuit board located in the middle layer of the multi-layer PCB board. An important feature of the inner layer board is that it needs to be processed to form a corresponding circuit structure on both surfaces, and the exposure of the circuit structure on both surfaces is required. There are certain alignment requirements for images. [0003] With the development of the industry, in order to improve the production capacity of the circuit structure formed by the LDI machine exposure to the inner layer board. When exposing the circuit structure patterns on two different surfaces of the inner layer board, two LDI machines are generally u...

Claims

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Application Information

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IPC IPC(8): G03F7/20G03F9/00
CPCG03F7/70558G03F7/70541G03F9/7003G03F9/7088
Inventor 吴越胡侠叶杨峰
Owner HANGZHOU XINNUO MICROELECTRONICS CO LTD
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