High-strength multilayer circuit board online pressing device

Abstract

The invention relates to an online pressing device for a high-strength multilayer circuit board. The online pressing device comprises a rack, a pressing assembly, a driver, a plurality of supporting columns, a plurality of rubber blocks and a plurality of elastic pieces, the driver is arranged on the rack; the pressing assembly comprises a pressing plate and a base plate, the driver is in driving connection with the pressing plate, the base plate and the pressing plate are oppositely arranged, the base plate is connected with the rack, the driver is used for driving the pressing plate to be close to or away from the base plate, and the pressing plate is a first rubber plate; the supporting columns are arranged on the face, facing the pressing plate, of the base plate in a protruding mode, the supporting columns are arranged in a matrix mode, one end of each supporting column is provided with a telescopic cavity, each rubber block is provided with a connecting part in a protruding mode, each elastic piece is arranged in the corresponding telescopic cavity, each connecting part is inserted into the corresponding telescopic cavity, one end of each elastic piece is connected with the corresponding connecting part, and the other end of each elastic piece is connected with the corresponding rubber block. And the other end of the elastic piece is connected with the bottom of the telescopic cavity, so that each rubber block forms an independent subarea on the substrate, the lamination device can adapt to positioning of multi-layer circuit boards with different specifications, and the applicability of the lamination device is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to an online pressing device for high-strength multilayer circuit boards. Background technique [0002] Multilayer circuit board is the product of the development of electronic technology in the direction of high speed, multi-function, large capacity and small volume. With the continuous development of electronic technology, especially the wide application of large-scale and ultra-large-scale integrated circuits, multi-layer circuit boards are rapidly developing towards high-density, high-precision, high-level digitalization, and there are fine lines, small aperture penetrations, and blind holes. Buried holes, high thickness-to-aperture ratio and other technologies to meet the needs of the market. [0003] During the production and processing of multilayer circuit boards, multiple circuit boards and multiple insulating layers need to be stacked and fixed on a lamin...

AI Technical Summary

Problems solved by technology

[0004] In order to ensure that the multi-layer circuit board can be well pressed on the insulating layer, it is necessary to apply a large force to achieve the stability between the circuit board and the insulating layer, so that the contact between the pressing plate and the circuit board is easy under a large pressure The side slip occurs on the surface of the circuit board, which makes the surface of the circuit board easy to produce traces, which reduces the smoothness and flatness of the multilayer circuit board surface. However, for the multilayer circuit board with relatively high precision requirements, the traces on the surface will directly affect the multilayer The flatness of the circuit board in the subsequent copper plating process cannot meet the standards required for production

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