Node and electronic equipment

An electronic device and node technology, applied in the server field, can solve problems such as damage to multiple nodes, difficulty in reaching 100% coverage of monitoring ropes, and spread to the entire server or other nodes in the electronic device.

Pending Publication Date: 2022-03-29
HUAWEI TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this technical solution, the coverage rate of the monitoring rope is difficult to reach 100%, and the timeliness of monitoring is poor
In addition, after the liquid cooling pipe leaks, the cooling l...

Method used

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  • Node and electronic equipment
  • Node and electronic equipment
  • Node and electronic equipment

Examples

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Embodiment Construction

[0045] The terms used in the following examples are for the purpose of describing particular examples only, and are not intended to limit the application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also Expressions such as "one or more" are included unless the context clearly dictates otherwise.

[0046] Reference to "one embodiment" or "a particular embodiment" or the like described in this specification means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. The terms "including", "comprising", "having" and variations thereof mean "including but not limited to", unless specifically stated otherwise.

[0047] In order to facilitate understanding of the nodes and electronic devices provided in the embodiments of the present application, the applicati...

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Abstract

The invention provides a node and electronic equipment. The node comprises a structure module, a circuit board, a liquid cooling pipe and a liquid leakage monitoring device. Wherein the circuit board is fixedly installed on the structure module, and electronic devices including chips and the like are arranged on the circuit board. The liquid cooling pipe is arranged on the circuit board and used for cooling electronic devices on the circuit board. The liquid leakage monitoring device comprises a drainage pipe arranged on the outer side of the liquid cooling pipe in a sleeving mode, a certain gap is formed between the drainage pipe and the liquid cooling pipe, and when the liquid cooling pipe leaks, leaked cooling liquid can flow in the drainage pipe and cannot flow at will, so that the problems of short circuit and the like of a circuit board are solved. The drainage pipe is connected with a liquid receiving disc, leaked cooling liquid flows into the liquid receiving disc from the drainage pipe, a first liquid leakage sensor is arranged in the liquid receiving disc, and when the first liquid leakage sensor monitors that the leaked cooling liquid exists in the liquid receiving disc, an alarm signal is sent out, so that a system or an operator can carry out data storage or power failure and other processing conveniently; and loss caused by leakage of the liquid cooling pipe is reduced.

Description

technical field [0001] The present application relates to the technical field of servers, in particular to a node and electronic equipment. Background technique [0002] With the advent of the era of artificial intelligence, chip power consumption increases faster and faster with the improvement of chip capabilities, which puts forward higher requirements on the heat dissipation capability of chips. Since the heat dissipation effect of the liquid-cooled heat dissipation device is better, liquid cooling has been used more and more as an important means for chip heat dissipation. For the technical means of liquid cooling and heat dissipation, it is necessary to install a liquid leakage monitoring device to monitor whether there is liquid leakage in the liquid cooling tube of the liquid cooling heat dissipation device, so as to prevent the cooling liquid leaking from the liquid cooling tube from damaging the electronic devices. [0003] In the prior art, the liquid leakage mon...

Claims

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Application Information

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IPC IPC(8): G01M3/18H05K7/20
CPCG01M3/182H05K7/20272H05K7/20772G01M3/188H05K1/0203H05K2201/064
Inventor 孙晓光高俊恩彭欢
Owner HUAWEI TECH CO LTD
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