Thermocouple sensor and preparation method thereof
A thermocouple sensor and thermocouple technology, applied in the manufacture/processing of thermoelectric devices, thermoelectric devices and instruments that only use the Peltier or Seebeck effect, can solve the problems of large chip footprint and low integration
Pending Publication Date: 2022-04-05
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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[0002] The thermopile is generally a single-layer structure, for example, the thermopile sensor chip disclosed by the utility model whose authorized announcement number is CN210040257U, a plurality of thermocouples connected in series are arranged at the same height to form a single-layer structure, so that the chip occupies a large area and can be integrated. degree is not high
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[0049]In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. the embodiment. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by those skilled in the art to which the present invention belongs. As used herein, "comprising" and similar words mean that the elements or items appearing before the word include the elements or items listed after the word and their equivalents, without excluding other elements or items.
[0050] T...
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The invention provides a thermocouple sensor and a preparation method thereof. The thermocouple sensor comprises a substrate, a thermocouple structure and a heat collection structure. The first thermocouple part and the second thermocouple part of each thermocouple of the thermocouple structure are arranged along a first direction from the bottom of the substrate to the top of the substrate to form a double-layer structure. In the same thermocouple, the first end part of the first thermocouple part and the first end part of the second thermocouple part are connected to form a hot end structure, and the plurality of hot end structures are arranged around the middle part of the isolation dielectric layer, so that the integration level is effectively improved; the heat transfer structure is opposite to the plurality of hot end structures, and the heat collection structure is arranged on the heat transfer structure, so that the heat conduction effect of the heat transfer structure to the plurality of hot end structures is improved, and the sensitivity of the thermopile structure is improved.
Description
technical field [0001] The invention relates to the technical field of semiconductor device manufacturing, in particular to a thermocouple sensor and a preparation method thereof. Background technique [0002] The thermopile is generally a single-layer structure, for example, the thermopile sensor chip disclosed by the utility model whose authorized announcement number is CN210040257U, a plurality of thermocouple pairs connected in series are arranged at the same height to form a single-layer structure, so that the chip occupies a large area and is integrated. The degree is not high. [0003] Therefore, it is necessary to develop a novel thermocouple sensor to solve the above-mentioned problems in the prior art. Contents of the invention [0004] The object of the present invention is to provide a thermocouple sensor and a preparation method thereof, so as to improve integration and sensitivity. [0005] To achieve the above object, the thermocouple sensor of the present...
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IPC IPC(8): H01L35/32H01L35/30H01L35/34G01K7/02H10N10/17H10N10/01H10N10/13
Inventor 康晓旭
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT