Semiconductor wafer, multi-wafer integrated packaging structure and packaging method thereof

Abstract

The invention provides a semiconductor wafer, a multi-wafer integrated packaging structure and a packaging method thereof. A bonding pad on the semiconductor wafer is in a long strip shape, one end of the bonding pad is a wafer connection area used for being connected with another wafer, and the other end of the bonding pad is a safety line connection area used for being connected with the wafer connection area. When the multiple wafers are integrally packaged, the wafer connecting area on one semiconductor wafer is connected with the wafer connecting area on the other semiconductor wafer through a wire; and the wafer connection area on the semiconductor wafer is connected with the safety line connection area on the semiconductor wafer through a safety line. According to the semiconductor wafer provided by the invention, the bonding pad on the semiconductor wafer is strip-shaped, and the wafer connecting area and the safety line connecting area are respectively arranged at the two ends of the bonding pad, so that a space is reserved for welding the safety line while the connection between two wafers is realized, the connection strength between a welding spot and the bonding pad is improved by additionally arranging the safety line, the welding spot is prevented from falling off, and the reliability of the semiconductor wafer is improved. And the reliability of the product is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to a semiconductor wafer, a multi-chip integrated packaging structure and a packaging method thereof. Background technique [0002] In the semiconductor packaging industry, the semiconductor wafer and the frame are connected by metal wires (gold wire, silver wire, copper wire, aluminum wire), and the functional pad of the wafer is connected to the pad of the frame. The pad (pad) is generally square or round, as follows figure 1 and figure 2 shown. [0003] The material of the pad on the wafer is generally metal aluminum, gold, etc. The package is connected to the wafer pad and the frame through a special wire bonding machine, as follows image 3 shown. [0004] image 3 Shown is the bonding wire from the wafer bonding wire to the frame, and the gold wire bonding wire is used to illustrate the following: [0005] The first welding point of the weld...

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a semiconductor wafer, a multi-chip integrated packaging structure and a packaging method thereof, which can solve the problem that the safety wire cannot be welded between wafers in the prior art

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