Display panel, display module and mobile terminal

[0037] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0038] see figure 1 , figure 1 The structure diagram of the film layer after cutting for the existing display panel. In the existing OLED display panel, in order to reduce the thickness of the display panel, the depolarizer technology can be used to make the OLED panel, that is, the existing polarizer is replaced by a color blocking layer and a black matrix layer, and in order to ensure the flatness of the product, It usually coats a first flat layer on the color filter layer, and sticks a protective layer on the first flat layer to protect the film layer. When the panel is cut, the temperature of the laser L may carbonize the black light-shielding layer 71 near the cutting surface 200, and at the same time, due to the small peeling force between the first protective layer 81 and the first flat layer 80, the carbonized black The material enters the gap between the first protective layer 81 and the first flat layer 80, which affects the cleanliness of the display panel. For details, please refer to figure 2 , the structure of the circle area in the figure is figure 1 Black unevenness in the middle area BB. Therefore, the present application proposes a display panel to solve the above technical problems.

[0039] see Figure 3 to Figure 11 , the present application provides a display panel 100, which may include a substrate 10, a light-emitting device layer 30 and a color filter layer 70, the light-emitting device layer 30 is disposed on the substrate 10; the color filter layer 70 is disposed on the On the light emitting device layer 30 , the substrate 10 includes a first boundary N1 on the side close to the cut surface 200 of the display panel 100 .

[0040] In this embodiment, in the top view direction of the display panel 200 , the film layer in the display panel 200 along the direction from the substrate 10 to the color filter layer 70 is close to the side of the cutting surface 200 The distance between the film boundary and the first boundary N1 gradually increases, and the included angle m between the cutting plane 200 and the substrate 10 is an obtuse angle.

[0041] It should be noted that the angle m between the cutting surface 200 and the substrate 10 is Figure 4 The actual included angle formed by the cutting plane 200 and the substrate 10 , the cutting plane 200 is inclined to the side away from the display panel 100 .

[0042] In this embodiment, the included angle m between the cutting surface 200 and the substrate 10 ranges from 100° to 120°.

[0043] In the present application, the cutting surface 200 of the edge of the display panel 100 is set away from the inclined surface of the display panel 100, so that the carbon chips generated during the cutting process of the display panel 100 are accumulated on the side close to the substrate 10, so as to avoid the carbon chips near the substrate 10. The residue on one side of the bottom 10 improves the cleanliness of the product.

[0044] The technical solutions of the present application will now be described with reference to specific embodiments.

[0045] see image 3 , image 3 The middle dotted line is the cutting lane GG of the target panel, and the shape enclosed by the cutting lane GG is the peripheral shape of the display panel 100 .

[0046] see Figure 4 and Figure 5 , Figure 4 for image 3 The first section of the mid-section AA, Figure 5 for Figure 4 The detailed structure diagram of the middle part of the membrane layer.

[0047] The display panel 100 may include a thin film transistor array layer 20 disposed on the substrate 10 , a pixel definition layer 40 disposed on the thin film transistor array layer 20 , and a light emitting diode disposed in the same layer as the pixel definition layer 40 . The device layer 30, the encapsulation layer 50 disposed on the pixel definition layer 40, the touch layer 60 disposed on the encapsulation layer 50, the color filter layer 70 disposed on the touch layer 60, and the The first flat layer 80 on the color filter layer 70 , and the first protective layer 81 disposed on the first flat layer 80 .

[0048] In this embodiment, the material of the substrate 10 may be glass, quartz, or polyimide.

[0049] In this example, see Figure 5 , the thin film transistor array layer 20 may include a plurality of thin film transistors 21, and the thin film transistors 21 may be of an etch stop type, a back channel etching type, or divided into bottom gate thin film transistors, Structures such as top-gate thin film transistors are not specifically limited. E.g, Figure 5 The thin film transistor 21 shown in the figure is a top-gate thin film transistor, and the thin film transistor 21 may include a light-shielding metal layer 211 disposed on the substrate 10, a buffer layer 212 disposed on the light-shielding metal layer 211, and a The active layer 213 on the buffer layer 212, the gate insulating layer 214 on the active layer 213, the gate layer 215 on the gate insulating layer 214, the gate layer 215 The upper inter-insulating layer 216 , the source-drain layer 217 disposed on the inter-insulating layer 216 , and the second flat layer 218 disposed on the source-drain layer 217 .

[0050] In this example, see Figure 5 , the display panel 100 may further include an anode layer 31 disposed on the second flat layer 218 , a light-emitting layer 33 disposed on the anode layer 31 , and a cathode layer 32 disposed on the light-emitting layer 33 . The anode layer 31 includes a plurality of anodes 311 , the pixel definition layer 40 includes a plurality of pixel openings corresponding to the plurality of the anodes 311 one-to-one, and each of the pixel openings exposes an upper surface of the anode 311 . On the surface, the light-emitting layer 33 may include a plurality of light-emitting pixels corresponding to the plurality of the anodes 311 one-to-one.

[0051] In this example, see Figure 4 , the encapsulation layer 50 covers the pixel definition layer 40, and continuously covers a plurality of pixel openings and a plurality of the light-emitting pixels; wherein, the encapsulation layer 50 may at least include a layered layer arranged on the pixel definition layer 40 a first inorganic encapsulation layer, a first organic encapsulation layer and a second inorganic encapsulation layer on the

[0052] In this example, see Figure 4 , the touch layer 60 may include a first touch metal layer and a second touch metal layer disposed on the packaging layer 50, and an insulating layer disposed between the first touch metal layer and the second touch metal layer Floor.

[0053] In this embodiment, the touch layer 60 provided in this embodiment of the present application may be of a mutual capacitance type or a self capacitance type.

[0054] In this example, see Figure 4 , the color filter layer 70 can be disposed on the touch layer 60, the color filter layer 70 can include a light shielding layer 71 and a plurality of color resist units 72 of different colors embedded in the light shielding layer 71, One of the color resist units 72 corresponds to one of the light emitting pixels, and the color of the color resist unit 72 is the same as the light emitted by the corresponding light emitting pixel.

[0055] In this example, see Figure 4 , the light-emitting layer 33 includes a first light-emitting pixel 331 that emits a first color, a second light-emitting pixel 332 that emits a second color, and a third light-emitting pixel 333 that emits a third color, and the color filter layer 70 includes the first color. A resistance unit 721, a second color resistance unit 722, and a third color resistance unit 723. The first light-emitting pixel 331 corresponds to the first color resistance unit 721, and the second light-emitting pixel 332 corresponds to the second color resistance unit 721. The unit 722 corresponds to the third light-emitting pixel 333 corresponds to the third color resistance unit 723 .

[0056] In this embodiment, the first light-emitting pixel 331 is a red light-emitting pixel, the second light-emitting pixel 332 is a green light-emitting pixel, the third light-emitting pixel 333 is a blue light-emitting pixel, and the first color resistance unit 721 is a red color resistor, the second color resistor unit 722 is a green color resistor, and the third color resistor unit 723 is a blue color resistor.

[0057] In this embodiment, the orthographic projection of the first light-emitting pixel 331 on the first color resistance unit 721 is located in the first color resistance unit 721 , and the second light-emitting pixel 332 is located in the second color resistance unit 721 . The orthographic projection of the resist unit 722 is located in the second color resist unit 722 , and the orthographic projection of the third light-emitting pixel 333 on the third color resist unit 723 is located in the third color resist unit 723 .

[0058] In this embodiment, the material of the first flat layer 80 may be the same as the organic material of the second flat layer 218 .

[0059] In this embodiment, the material of the first protective layer 81 may be a flexible material such as polyethylene terephthalate.

[0060] In this embodiment, the display panel 100 may further include a backplane 90 and a second protective layer 91 attached to the backplane 90 . The backplane 90 is disposed on a side of the substrate 10 away from the light-emitting direction. side, the second protective film is located on the side of the back plate 90 away from the light-emitting direction.

[0061] In this embodiment, the function of the second protective layer 91 is the same as that of the first protective layer 81 , and the material of the second protective layer 91 may be the same as the material of the first protective layer 81 .

[0062] In this embodiment, the peeling force between the first protective layer 81 and the first flat layer 80 is 1 to 4 g/inch, and the peeling force between the second protective layer 91 and the back plate 90 is 1 to 4 g/inch. The force is 45 to 55 g/inch.

[0063] In this embodiment, the first protective layer 81 and the second protective layer 91 are intermediate products in the manufacturing process of the display panel 100 , and exist only in the intermediate process of the manufacturing process to protect the first flat layer 80 and the Other film layer structures below; and in the final product, the first protective layer 81 and the second protective layer 91 will be peeled off.

[0064] see Figure 4 , the display panel 100 may include a display area 300 and a non-display area 400 at the periphery of the display area 300 , and a cutting area 500 and a cutting product 600 left by cutting are provided on the side away from the non-display area 400 .

[0065] During the cutting process of the display panel 100, the laser light L needs to be used to cut the display panel 100, for example Figure 4 In the structure in , the product on the left side of the cutting area 500 is the target product, and the product on the right side of the cutting area 500 is the useless cutting product 600 .

[0066] In this embodiment, since the light spot of the laser laser L is a Gaussian light spot, please refer to Image 6 As shown, the laser laser L has the characteristics of high energy in the middle and successively decreasing energy around the edges, so the cross-section of the film layer cut by the laser laser L may be in a triangular shape.

[0067] In this embodiment, the organic material is carbonized due to the high temperature of the laser L, and the peeling force between the first protective layer 81 and the first flat layer 80 is smaller than that between the second protective layer 91 and the second protective layer 91 . The peeling force between the back plates 90 , so if the cutting is started from the light-emitting direction side of the display panel 100 , the carbon chips generated by the laser L may remain between the first protective layer 81 and the first flat layer 80 . between. see Figure 4 In this application, the laser laser L is used to start cutting from the backlight side of the display panel 100, and the carbon scraps generated by the laser laser L are accumulated to the light-emitting side away from the display panel 100 by the action of gravity. The peeling force between the back plate 90 and the back plate 90 is relatively large, and the carbon chips can only remain on the surface of the cutting surface 200 , and will not enter between the second protective layer 91 and the back plate 90, and will be affected by gravity. Or follow-up edge cleaning will remove some residual carbon chips.

[0068] In this embodiment, the cross-section of the film layer cut by the laser L is an equilateral triangle.

[0069] In the display panel 100 of the present application, please refer to Figure 4 , in the direction from the substrate 10 to the color filter layer 70, the distance between the film layer boundary on the side of the display panel 100 close to the cut surface 200 and the first boundary N1 gradually increases; In the direction from the substrate 10 to the color filter layer 70, without considering the patterning of each film layer, the outer contour area of ​​the film layer in the display panel 100 gradually increases.

[0070] In this embodiment, in addition to the characteristics of the laser light L itself, since the film layer on the side close to the light-emitting direction has more organic materials, such as the first flat layer 80, the color filter layer 70, the pixel definition layer 40, etc., and The high temperature action of the laser L will cause the organic material to be carbonized, resulting in carbon chips that affect the cleanliness of the panel. Therefore, the outer contour area of ​​the film layer on the side close to the light output direction can be larger than the outer contour area of ​​the film layer on the side away from the light output direction. That is, the distance between the boundary of the film layer on the side close to the light-emitting direction and the first boundary N1 is smaller than the distance between the boundary of the film layer on the side away from the light-emitting direction and the first boundary N1, that is, the film layer away from the light-emitting direction is first cut. It has a large opening, and at the same time, the generated carbon chips can be directly dropped from the bottom opening by the action of gravity, so as to avoid the accumulation of carbon chips; and for the plan of cutting from the light-emitting side, due to the film layer close to the light-emitting direction side With more organic materials, the generated carbon chips will fall from the side away from the light-emitting side along with the entire cutting process, so that more carbon chips remain on the surface of the film layer. Therefore, the technical solution of the present application can fundamentally solve the residual carbon chips. The problem.

[0071] During the cutting process, as the laser light L moves along the light emission direction of the display panel 100 , the cutting surface 200 of the display panel 100 is an inclined surface with a certain inclination angle due to the influence of the characteristics of the laser laser L itself.

[0072] In this embodiment, the included angle m between the cutting surface 200 and the substrate 10 may range from 100° to 120°, and the included angle m may be the actual included angle between the cutting surface 200 and the substrate 10 . Due to the characteristics of the laser laser L itself, the angle m between the cutting surface 200 and the substrate 10 can be as close to 90° as possible by controlling the energy of the laser laser L, but currently it can only reach 120° due to the limitation of the process. Edge grinding or other processing makes the angle between the side of the display panel 100 and the substrate 10 approach 90°.

[0073] In the display panel 100 of the present application, the display panel 100 includes multiple organic layers, and at least one side of the organic layer close to the cut surface 200 is provided with a black material.

[0074] In this embodiment, since the display panel 100 includes organic layers such as the first flat layer 80 , the color filter layer 70 , the organic encapsulation layer, and the pixel definition layer 40 , the high temperature of the laser L may cause the organic material to be carbonized. After the cutting is completed, carbon chips may remain in the edge region of the film layer after carbonization. In the subsequent edging process, the carbon chips cannot be completely eliminated, so they may remain on the cutting surface 200 . At the same time, the carbonized organic layer is attached to the side of the organic layer, which can protect the organic material in the display area 300 to a certain extent, such as blocking water and oxygen.

[0075] In this embodiment, since the generated carbon chips will fall to the side away from the light emitting direction of the display panel 100 due to the action of gravity, more carbon chips may remain on the side away from the light emitting direction of the display panel 100, that is, close to the display panel 100. The mass of the black material on the organic layer on the side of the substrate 10 is greater than the mass of the black material on the organic layer on the side away from the substrate.

[0076] In the display panel 100 of the present application, the light-shielding layer 71 includes a first light-shielding portion 711 close to the cut surface 200 of the display panel 100 , and the first light-shielding portion 711 includes a second boundary close to the cut surface 200 . N2, the distance between the second boundary N2 and the cutting surface 200 is greater than or equal to 0 and less than or equal to 150 microns.

[0077] see Figure 4 , when the distance from the second boundary N2 to the cutting plane is equal to 0, the second boundary N2 and the cutting plane coincide. see Figure 7 , Figure 7 for Figure 4 The cross-sectional view of the display panel 100 in Fig. 2 before cutting is performed, the first light shielding portion 711 extends from the non-display area 400 to the cutting area 500, and the laser L directly contacts the first light shielding portion 711 during cutting. The black carbon chips will fall from the bottom of the display panel 100 under the action of gravity.

[0078] In the display panel 100 of the present application, please refer to Figure 8 , the light-shielding layer 71 further includes a second light-shielding portion 712 away from the cutting surface 200 , and the thickness of the second light-shielding portion 712 may be greater than the thickness of the first light-shielding portion 711 .

[0079] In this embodiment, the light-shielding layer 71 may include a second light-shielding portion 712 disposed in the display area 300 and a first light-shielding portion 711 disposed in the non-display area 400 . Since the first light-shielding portion 711 is close to the The cutting surface 200 is provided, that is, when the display panel 100 is cut, the distance between the boundary of the first light shielding portion 711 and the laser light L having a relatively high temperature is small, and there is a boundary where the laser laser L carbonizes the first light shielding portion 711 However, in the present application, by reducing the thickness of the first light shielding portion 711 , the generation of carbon scraps can be reduced when the first light shielding portion 711 is carbonized.

[0080] exist Figure 4 On the basis of , since the high temperature of the laser L has a certain carbonization effect on the organic material, the present application separates the light-shielding material that may be carbonized from the cutting area 500 .

[0081] In the display panel 100 of the present application, please refer to Figure 9 , the display panel 100 further includes a first flat layer 80 disposed on the color filter layer 70 , the first flat layer 80 covers the color filter layer 70 , and the first flat layer 80 can cover the first flat layer 80 A light-shielding portion 711 extends toward the cutting surface 200 , and the second boundary N2 of the first light-shielding portion is disposed away from the cutting surface.

[0082] In this embodiment, the distance between the second boundary N2 and the cutting surface 200 is less than or equal to 150 μm.

[0083] see Figure 9 , the light-shielding layer 71 may also be provided with a first notch 710 in the area close to the cutting surface 200 of the display panel 100 , and the first notch 710 faces the cutting surface 200 ; meanwhile, the first flat layer 80 is close to the cutting surface 200 . The area of ​​the cutting surface 200 is provided with a second notch 810 , and the second notch 810 faces the cutting surface 200 .

[0084] see Figure 9 , because the thicknesses of the color resist unit 72 and the light-shielding layer 71 are inconsistent, the flatness of the color filter layer 70 is low after the color filter process is completed, so it is necessary to set the first flat layer 80 on the color filter layer 70; At the same time, since the first flat layer 80 is made of organic material, the material of the flat layer can also be carbonized to form black carbon chips when the laser L is cutting, so the first flat layer 80 is close to the cutting surface 200 A flat layer material cannot be provided on one side.

[0085] see Figure 10 , Figure 10 This is a cross-sectional structural diagram of the cross-section AA of the display panel 100 of the present application before cutting. Both the light shielding layer 71 and the first flat layer 80 are hollowed out on the side close to the scribe line GG. Since both the first flat layer 80 and the light shielding layer 71 can be made of photoresist organic materials, the hollowing out The region can be formed by a mask process, for example, through an exposure and development process, and the edges of the first flat layer 80 and the light shielding layer 71 are hollowed out, so as to make the first flat layer 80 and the light shielding layer The border of 71 is away from the cut GG.

[0086] In this embodiment, the second notch 810 corresponds to the first notch 710, and the area of ​​the second notch 810 may be greater than or equal to the area of ​​the first notch 710, so as to further increase the second notch The boundary of the notch 810 and the distance between the cutting surface 200 .

[0087] In the present application, a second notch 810 is formed in the region of the first flat layer 80 close to the cutting surface 200 , so that the boundary of the first flat layer 80 is far away from the cutting surface 200 , even if the first flat layer 80 is The boundary is far away from the scribe line GG, which prevents the organic material constituting the first flat layer 80 from being carbonized by the high temperature of the laser light L. As shown in FIG.

[0088] In the display panel 100 of the present application, please refer to Figure 4 , the thickness of the first flat layer 80 may be less than or equal to the thickness of the second light shielding portion 712 . Since the first flat layer 80 is disposed close to the cutting surface 200 , in order to avoid the proportion of the first flat layer 80 being carbonized by the laser L, the present application can reduce the thickness of the first flat layer 80 .

[0089] In this embodiment, since the first flat layer 80 is mainly used to flatten the surface of the uneven color filter layer 70 , the first flat layer 80 only needs to ensure the flatness of the surface of the color filter layer 70 . That is, the minimum thickness of the first flat layer 80 is the difference between the thicknesses of the color resist unit 72 and the light shielding layer 71 to ensure that the thickness of the area corresponding to the light shielding layer 71 is the same as the thickness of the area corresponding to the color resist unit 72 .

[0090] The present application also proposes a display module 700, please refer to Figure 11 , the display module 700 includes the above-mentioned display panel 100 and a cover layer CG located on the display panel 100; the orthographic projection of the display panel 100 on the cover layer CG is located in the cover layer CG .

[0091] In this example, with Figure 4 compared to the structure in Figure 11 The structure in will Figure 4 The first protective layer 81 and the second protective layer 91 are removed, and at the same time, the display panel 100 can attach the first flat layer 80 and the cover layer CG to the display panel 100 through optical glue.

[0092] In this embodiment, the cover layer CG mainly protects the underlying panel structure. Therefore, in the top view direction of the display module 700 , the outer boundary of the cover layer CG should be larger than the outer boundary of the display panel 100 .

[0093] The present application also proposes a mobile terminal, which includes a terminal main body and the above-mentioned display module, wherein the terminal main body and the display module are combined into a whole. The terminal body may be a device such as a circuit board bound to the display module. The mobile terminal may include electronic devices such as a mobile phone, a TV, and a notebook computer.

[0094] The present application discloses a display panel, a display module, and a mobile terminal; the display panel includes a substrate, a light-emitting device layer disposed on the substrate, and a color filter layer disposed on the light-emitting device layer, and the substrate includes a substrate close to the The first boundary on one side of the cut surface of the display panel, in the direction of the top view of the display panel, the film layer in the display panel along the direction from the substrate to the color filter layer is close to the cut surface The distance between the film boundary on the side and the first boundary gradually increases, and the included angle between the cutting surface and the substrate is an obtuse angle. In the present application, the cutting surface of the edge of the display panel is set away from the inclined surface of the display panel, The carbon chips generated during the cutting process of the display panel are accumulated on the side close to the substrate, the residue of carbon chips on the side close to the substrate is avoided, and the cleanliness of the product is improved.

[0095] In the above-mentioned embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0096] A display panel, a display module, and a mobile terminal provided by the embodiments of the present application have been introduced in detail above. The principles and implementations of the present application are described in this article by using specific examples. The descriptions of the above embodiments are only used for Help to understand the technical solution of the present application and its core idea; those of ordinary skill in the art should understand: it can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements to some of the technical features; and these modifications Or alternatively, the essence of the corresponding technical solution does not deviate from the scope of the technical solutions of the embodiments of the present application.