Cleaning assembly
A technology for components and cleaning liquids, applied in electrical components, cleaning methods and utensils, cleaning methods using liquids, etc. rate, etc.
Active Publication Date: 2022-04-12
INST OF MICROELECTRONICS CHINESE ACAD OF SCI +1
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- Abstract
- Description
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- Application Information
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Problems solved by technology
However, using the cleaning device in the prior art, the cleaning brush may scratch the surface of the wafer and leave scratches on the surface of the wafer, thereby affecting the processing yield of semiconductor devices
Method used
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[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is only some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0026] In order to facilitate the understanding of the cleaning component provided by the embodiment of the present invention, the application scenario of the cleaning component provided by the embodiment of the present invention is firstly described below. The cleaning component is used to clean the surface of the wafer, which can clean the w...
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The invention provides a cleaning assembly. The cleaning assembly comprises a rotary supporting assembly and a cleaning device arranged on one side of a wafer. The cleaning device comprises a first spray head assembly, a second spray head assembly and an ultrasonic vibration device, and the first spray head assembly is located on one side of the wafer and sprays cleaning liquid to the surface of the wafer; the second spray head assembly and the first spray head assembly are located on the same side of the wafer, the second spray head assembly is located below the first spray head assembly, and the second spray head assembly sprays cleaning gas to the surface of the wafer; the ultrasonic vibration device is arranged between the first spray head assembly and the second spray head assembly. The cleaning gas sprayed by the second spray head assembly can prevent the cleaning liquid sprayed to the surface of the wafer from the first spray head assembly from flowing downwards, so that a medium for the ultrasonic vibration device to emit ultrasonic waves to the surface of the wafer is formed between the ultrasonic vibration device and the surface of the wafer. Therefore, the cleaning device is not in physical contact with the surface of the wafer, so that scratches on the surface of the wafer are reduced, and scratches on the surface of the wafer are reduced.
Description
technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a cleaning component. Background technique [0002] With the integration of semiconductor devices, the volume of structures on the semiconductor devices gradually decreases. In this case, in the semiconductor manufacturing process, defects such as small scratches on the surface of the wafer may affect the processing yield of the semiconductor device. [0003] During semiconductor processing, after a CMP (chemical mechanical polish, chemical mechanical polishing) process is performed on the surface of the wafer, the surface of the wafer is cleaned. The cleaning device in the prior art mainly adopts a cleaning brush and a cleaning liquid. There is a certain gap between the cleaning brush and the wafer surface, and the cleaning liquid is filled in the gap between the cleaning brush and the wafer surface, and the cleaning brush rotates to drive the cleaning liqui...
Claims
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IPC IPC(8): B08B3/02B08B5/02B08B3/12B08B13/00H01L21/67
CPCY02P70/50
Inventor 金相一张月杨涛卢一泓刘青
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI