Device for laser cutting of low-temperature co-fired ceramic

Abstract

The invention discloses a device for laser cutting of low-temperature co-fired ceramic, particularly relates to the technical field of low-temperature co-fired ceramic processing, and aims to solve the problems that most laser cutting devices cannot realize synchronous development of low-temperature co-fired ceramic plate cutting operation, discharging operation and feeding operation, so that the processing efficiency is reduced. Most of clamping mechanisms used on the laser cutting device cannot adjust the height of clamping blocks according to actual requirements, so that the low-temperature co-fired ceramic plates with different sizes cannot be stably clamped, and most of the cutting devices are not provided with heat dissipation mechanisms; the low-temperature co-fired ceramic plate cutting device comprises a mounting frame, an intermittent driving mechanism is arranged on the inner side of the mounting frame, and clamping mechanisms distributed in an array mode are fixedly connected to the top end of the intermittent driving mechanism; the cutting operation, the discharging operation and the feeding operation of the low-temperature co-fired ceramic plate can be synchronously carried out, so that the processing efficiency is effectively improved.

Description

technical field [0001] The invention relates to the technical field of low-temperature co-fired ceramic processing, in particular to a device for laser cutting low-temperature co-fired ceramics. Background technique [0002] Low-temperature co-fired ceramic technology is to make low-temperature sintered ceramic powder into a green ceramic belt with precise thickness and density. Low-temperature co-fired ceramic technology is a new material technology developed by Hughes in 1982. It uses thick film materials. Structural manufacturing of fired ceramic design, which is a technology used to achieve high-integration, high-performance electronic packaging. [0003] During the production of low-temperature co-fired ceramics, in order to obtain low-temperature co-fired ceramic plates of different shapes and types, it is necessary to use a laser cutting device to cut them, but the current laser cutting device used for cutting low-temperature co-fired ceramic plates still has certain ...

AI Technical Summary

Problems solved by technology

[0004] 1. Most of the existing laser cutting devices cannot realize the simultaneous development of low-temperature co-fired ceramic plate cutting operations, blanking operations and loading operations, thereby reducing processing efficiency;

[0005] 2. Most of the clamping mechanisms used in existing laser cutting devices cannot adjust the height of clamping blocks according to actual needs, so that it is impossible to stably clamp low-temperature co-fired ceramic plates of different sizes, and thus cannot guarantee the stability of cutting operations carry out, less practical;

[0006] 3. Most of the existing laser cutting devices are not equipped with a heat dissipation mechanism, which easily leads to the phenomenon of bursting of low-temperature co-fired ceramic plates due to heat accumulation during cutting

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