Defect detection device for semiconductor chip

Abstract

The invention relates to the technical field of chip detection, and discloses a semiconductor chip defect detection device which comprises a bottom plate, first supporting plates are arranged on the two sides of the bottom plate, conveying rollers are rotationally connected to the ends of the first supporting plates, a conveying belt is arranged outside the conveying rollers, and the semiconductor chip defect detection device further comprises a reversing mechanism and a detection mechanism; the reversing mechanism is arranged on one side of the bottom plate and comprises a second supporting plate fixedly connected with the bottom plate, a sliding groove is formed in the middle of the second supporting plate and slidably connected with a sliding block, and the middle of the sliding block is rotationally connected with a second rotating shaft; the detection mechanism comprises a third supporting plate fixedly connected with the middle of the side edge of the bottom plate, a top plate is arranged at the top end of the third supporting plate, and a camera is arranged on the side, close to the bottom plate, of the top plate. According to the defect detection device for the semiconductor chip, by arranging the reversing mechanism, the chip can be reversed while being grabbed, and the chip can be placed on the detection mechanism with the pins facing upwards to be photographed and detected.

Description

technical field [0001] The invention relates to the technical field of chip detection, in particular to a defect detection device for semiconductor chips. Background technique [0002] Today's chip packaging is rapidly developing in the direction of miniaturization, chipping, and high performance, and the requirements for defect detection of chip packaging are gradually increasing. Defect detection of chip pins is a necessary prerequisite for proper packaging. The way of shooting is often used to detect the pins of the chip. [0003] However, in the process of chip processing and transportation, the chip is sometimes placed with the pins down. When the pins of the chip are detected, the chip usually needs to be turned over, but the mechanism of the entire assembly line needs to be stopped when the conventional manipulator is turned over. , leading to a decrease in the overall production efficiency, so it needs to be improved. Contents of the invention [0004] The prese...

AI Technical Summary

Problems solved by technology

[0003] However, in the process of chip processing and transportation, the chip is sometimes placed with the pins down. When the pins of the chip are detected, the chip usually needs to be turned over, but the mechanism of the entire assembly line needs to be stopped when the conventional manipulator is turned over. , leading to a decrease in the overall production efficiency, so it needs to be improved

Images