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Wafer control wafer detection method and device

A detection method and detection device technology, which are applied in image data processing, instrument, character and pattern recognition, etc., can solve the problems of low wafer control and wafer detection efficiency, and achieve the effect of saving time, improving success rate and improving efficiency.

Pending Publication Date: 2022-04-12
YANGTZE MEMORY TECH CO LTD
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Problems solved by technology

[0006] The invention provides a wafer control chip detection method and device, which are used to solve the problem of low defect detection efficiency on the wafer control chip in the prior art, and improve the accuracy of defect detection on the wafer control chip

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  • Wafer control wafer detection method and device
  • Wafer control wafer detection method and device
  • Wafer control wafer detection method and device

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Embodiment Construction

[0057] The following describes in detail the specific implementation of the method and device for wafer control inspection provided by the present invention in conjunction with the accompanying drawings.

[0058]Currently, the detection of defects on the wafer control is mainly to scan the wafer control with an electron beam of a SEM (Scanning Electron Microscope, Scanning Electron Microscope), so as to determine the type and shape of the defect on the wafer control. However, due to the slow scanning rate of the SEM machine, the SEM machine will use random classification for sampling and measurement, in order to capture all kinds of defects on the wafer control chip with the greatest probability for analysis by engineers . However, the above-mentioned defect detection method has at least the following three defects: First, due to the slow scanning rate of the SEM machine, only random sampling and measurement can be performed, resulting in a long waiting time for the online mac...

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Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer control wafer detection method and device. The wafer control wafer detection method comprises the following steps: shooting an original image of a to-be-detected wafer control wafer; acquiring first defect information of the wafer control wafer according to the original image, wherein the first defect information comprises a plurality of defect types and the position of each defect type on the wafer control wafer; and performing electron beam scanning on the wafer control wafer according to the first defect information to obtain a defect image of each defect type. According to the invention, the efficiency and accuracy of wafer control wafer detection are improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method and device for wafer control detection. Background technique [0002] With the development of planar flash memory, the production process of semiconductors has made great progress. However, in recent years, the development of planar flash memory has encountered various challenges: physical limits, existing development technology limits, and storage electron density limits. In this context, in order to solve the difficulties encountered in planar flash memory and pursue lower production costs per unit storage unit, various three-dimensional (3D) flash memory structures have emerged, such as 3D NOR (3D or not) flash memory and 3D NAND (3D NAND) flash memory. [0003] Among them, 3D NAND memory takes its small size and large capacity as the starting point, and the design concept of highly integrated storage units stacked in three-dimensional mode is to...

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Application Information

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IPC IPC(8): G06T7/00G06K9/62G06V10/764
Inventor 詹万鹏屠礼明张卫涛
Owner YANGTZE MEMORY TECH CO LTD