Preparation and disassembly of double-dynamic covalent bond parallel interlocking thermosetting polymer
A dynamic covalent bond, epoxy polymer technology, applied in the field of polymer materials, can solve problems such as single disassembly method, hidden safety hazards in use stability, and harsh disassembly conditions.
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specific Embodiment approach 1
[0010] Specific embodiment one: the selective disassembly epoxy polymer based on double dynamic covalent bond "parallel interlocking" crosslinking of the present invention, according to parts by weight, consists of 50-100 parts of epoxy resin and two kinds of 1:1 A total amount of 20-80 parts of epoxy curing agent is cured at high temperature to completely obtain a selectively disassembled epoxy polymer based on double dynamic covalent bond "parallel interlocking" crosslinking.
[0011] The epoxy resin is bisphenol A diglycidyl ether, and the epoxy curing agent is dithiodiphenylamine and diamine containing imine bonds.
[0012] The "parallel interlocking" cross-linked epoxy polymer based on disulfide bonds and imine bonds has good stability and selective disassembly, such as figure 2 shown.
specific Embodiment approach 2
[0013] Specific embodiment two: the optional disassembly epoxy polymer based on double dynamic covalent bond "parallel interlocking" cross-linking of the present invention, according to parts by weight, consists of 80-100 parts of epoxy resin and two kinds of 1:1 A total of 60-80 parts of epoxy curing agent is cured at high temperature to completely obtain a selectively disassembled epoxy polymer based on double dynamic covalent bond "parallel interlocking" crosslinking.
[0014] The epoxy resin is bisphenol S diglycidyl ether, and the epoxy curing agent is dithiodianiline and diamine containing phenylboronic ester bonds.
[0015] The "parallel interlocking" cross-linked epoxy polymer based on disulfide bonds and phenylboronate bonds has good stability and selective disassembly.
specific Embodiment approach 3
[0016] Specific embodiment three: The epoxy polymer based on double dynamic covalent bond "parallel interlocking" cross-linking of the present invention can be selectively disassembled, according to parts by weight by 80-100 parts of epoxy resin and two kinds of 1:2 A total of 60-80 parts of epoxy curing agent is cured at high temperature to completely obtain a selectively disassembled epoxy polymer based on double dynamic covalent bond "parallel interlocking" crosslinking.
[0017] The epoxy resin is 1,4 butanediol diglycidyl ether, and the epoxy curing agent is dithiodiphenylamine and diamine containing imine bonds.
[0018] The "parallel interlocking" cross-linked epoxy polymer based on disulfide bonds and imine bonds has good stability and selective disassembly.
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