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Preparation and disassembly of double-dynamic covalent bond parallel interlocking thermosetting polymer

A dynamic covalent bond, epoxy polymer technology, applied in the field of polymer materials, can solve problems such as single disassembly method, hidden safety hazards in use stability, and harsh disassembly conditions.

Pending Publication Date: 2022-04-15
SOUTHWEAT UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the previous dismantled thermosetting materials based on dynamic bond crosslinking had the problems of harsh disassembly conditions and single disassembly methods, and at the same time brought safety hazards to their stability.

Method used

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  • Preparation and disassembly of double-dynamic covalent bond parallel interlocking thermosetting polymer
  • Preparation and disassembly of double-dynamic covalent bond parallel interlocking thermosetting polymer

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0010] Specific embodiment one: the selective disassembly epoxy polymer based on double dynamic covalent bond "parallel interlocking" crosslinking of the present invention, according to parts by weight, consists of 50-100 parts of epoxy resin and two kinds of 1:1 A total amount of 20-80 parts of epoxy curing agent is cured at high temperature to completely obtain a selectively disassembled epoxy polymer based on double dynamic covalent bond "parallel interlocking" crosslinking.

[0011] The epoxy resin is bisphenol A diglycidyl ether, and the epoxy curing agent is dithiodiphenylamine and diamine containing imine bonds.

[0012] The "parallel interlocking" cross-linked epoxy polymer based on disulfide bonds and imine bonds has good stability and selective disassembly, such as figure 2 shown.

specific Embodiment approach 2

[0013] Specific embodiment two: the optional disassembly epoxy polymer based on double dynamic covalent bond "parallel interlocking" cross-linking of the present invention, according to parts by weight, consists of 80-100 parts of epoxy resin and two kinds of 1:1 A total of 60-80 parts of epoxy curing agent is cured at high temperature to completely obtain a selectively disassembled epoxy polymer based on double dynamic covalent bond "parallel interlocking" crosslinking.

[0014] The epoxy resin is bisphenol S diglycidyl ether, and the epoxy curing agent is dithiodianiline and diamine containing phenylboronic ester bonds.

[0015] The "parallel interlocking" cross-linked epoxy polymer based on disulfide bonds and phenylboronate bonds has good stability and selective disassembly.

specific Embodiment approach 3

[0016] Specific embodiment three: The epoxy polymer based on double dynamic covalent bond "parallel interlocking" cross-linking of the present invention can be selectively disassembled, according to parts by weight by 80-100 parts of epoxy resin and two kinds of 1:2 A total of 60-80 parts of epoxy curing agent is cured at high temperature to completely obtain a selectively disassembled epoxy polymer based on double dynamic covalent bond "parallel interlocking" crosslinking.

[0017] The epoxy resin is 1,4 butanediol diglycidyl ether, and the epoxy curing agent is dithiodiphenylamine and diamine containing imine bonds.

[0018] The "parallel interlocking" cross-linked epoxy polymer based on disulfide bonds and imine bonds has good stability and selective disassembly.

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Abstract

The invention provides a selectively detachable epoxy polymer based on double dynamic covalent bond parallel interlocking crosslinking. 50-100 parts by weight of epoxy resin and 20-80 parts by weight of two epoxy curing agents with different proportions are completely cured at high temperature to obtain the selectively detachable epoxy polymer based on double-dynamic covalent bond parallel interlocking crosslinking. According to the cross-linked epoxy polymer based on double-dynamic covalent bond parallel interlocking, the use stability of a material can be improved while the detachable performance of the material is reserved.

Description

technical field [0001] The invention belongs to the field of polymer materials, and relates to a method for preparing and disassembling a thermosetting polymer based on double dynamic covalent bond "parallel interlocking". Background technique [0002] Due to the advantages of stable structure and excellent mechanical properties, thermosetting polymer materials have been widely used in the fields of aerospace, military defense, rail transportation and construction. However, once the thermosetting material is cured, it will form a three-dimensional cross-linked network structure, making it impossible to repair, disassemble and reshape. Because waste thermosetting materials are insoluble and insoluble, the usual disposal method is to bury or incinerate, which brings a series of problems such as waste of resources and environmental pollution. [0003] Introducing dynamic bonds into thermosets to construct covalent adaptable networks is an effective way to endow thermosets with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/50
Inventor 周琳向仕鹏陈茂
Owner SOUTHWEAT UNIV OF SCI & TECH