Multi-particle-size filler filling type composite material fluidity simulation method
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
- Publication Date
- 2022-04-15
Smart Images

Figure 1 
Figure 2 
Figure 3
Abstract
Description
technical field
[0001] The invention relates to the technical field of polymer composite material design, and more specifically, to a method for simulating the fluidity of a multi-particle size filler-filled composite material. Background technique
[0002] Multi-size filler-filled composite materials are widely used in the field of electronic packaging, such as underfill (Underfill), thermal interface material (TIM), etc. As the filling density of fillers increases, agglomeration between fillers tends to occur, the friction effect between fillers increases, and the interface area between fillers and matrix increases, resulting in poor fluidity of composite materials, which is not conducive to material processing and molding. The microscopic factors that affect the macroscopic viscosity of composite materials include: filler packing density, filler particle size, particle size distribution, filler and matrix material properties, etc. It is difficult to analyze the specific ...