Panel detection method and device, electronic equipment and storage medium

Abstract

The embodiment of the invention provides a panel detection method and device, electronic equipment and a storage medium. The method comprises the following steps: acquiring an image of a to-be-detected panel; in an image of a panel to be detected, aiming at an electrode pair formed by a glass electrode and a core electrode of the panel to be detected, the following detection steps are executed to determine whether the panel to be detected is qualified, and the glass electrode and the core electrode in the electrode pair are jointed: identifying the glass electrode and the core electrode in the electrode pair; determining transverse center positions of the identified glass electrode and the core electrode; and determining the particle lateral offset between the glass electrode and the core electrode in the electrode pair according to the determined respective lateral center positions of the glass electrode and the core electrode. Compared with a traditional indirect measurement mode, the technical scheme is simpler and easier to operate, and the missed detection risk is lower. Meanwhile, the measurement mode in the technical scheme is not affected by uneven particle distribution, and the accuracy of a panel detection result is improved.

Description

technical field [0001] The present invention relates to the technical field of panel detection, and more particularly to a panel detection method, a panel detection device, an electronic device and a storage medium. Background technique [0002] Flexible circuit board technology on glass (FPC On Glass, referred to as FOG) is a technology in which flexible circuit boards (FPC) are directly bound to glass plates, and are widely used in various display products such as liquid crystal displays and electroluminescent technologies. In the FOG process, the electrode of the flexible circuit board is aligned with the glass electrode (bump) on the glass plate, and the anisotropic conductive film (ACF) is used as the dielectric material for bonding, and the flexible circuit board is realized through high temperature and high pressure for a certain period of time. The connection and conduction of the electrode and the glass electrode on the glass plate. Similarly, IC on Film (COF for s...

AI Technical Summary

Problems solved by technology

This method is affected by the random distribution of particles, so there is a certain risk of missed detection, which in turn affects the accuracy of panel detection results.

Furthermore, the panel inspection results based on low accuracy may increase the waste of materials and man-hours in subsequent sections, reducing the yield of panel products

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