Resin hole plugging device and method for double-sided back drilling printed circuit board

A technology for printed circuit boards and resin plug holes, which is applied in the fields of printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of resin plug holes, such as holes and difficult filling, and achieve the effect of ingenious structure

Active Publication Date: 2022-04-15
四川英创力电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Resin plugging is usually required after the back drilling process is completed. However, when the printed circuit board has back drilling holes on both sides, when the resin plugs the holes, because the back drilling ho

Method used

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  • Resin hole plugging device and method for double-sided back drilling printed circuit board
  • Resin hole plugging device and method for double-sided back drilling printed circuit board
  • Resin hole plugging device and method for double-sided back drilling printed circuit board

Examples

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Embodiment 2

[0051] like Figure 8 As shown, this embodiment provides a double-sided back-drilling printed circuit board resin plugging method, using the double-sided back-drilled printed circuit board resin plugging device in Example 1, including the following steps:

[0052] S1, back drilling: double-sided back drilling of the printed circuit board 5, respectively the first back drilling 5-1 on the top surface and the second back drilling 5-2 on the bottom surface, the first back drilling 5- 1. The inner diameter is first large and then small, and the second back drilling 5-2. The inner diameter is small first and then large;

[0053] S2, the first resin plug hole:

[0054] Place the printed circuit board 5 in the slot 34 with the top facing up;

[0055] Utilize the vacuum adsorption hole 35 to adsorb and fix the printed circuit board 5;

[0056] The grease injection pipe head 211 of the resin injection assembly 21 is lowered to a suitable position, and the resin is injected into the ...

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Abstract

The invention discloses a resin hole plugging device and method for a double-sided back drilling printed circuit board. The resin hole plugging device comprises a turnover mechanism, a vacuum resin hole plugging machine and a plurality of bearing mechanisms arranged in a horizontal array mode, each bearing mechanism comprises a first bevel gear, a horizontal rod and a bearing frame which are sequentially connected, the horizontal rods are connected to the supporting rods through bearings, clamping grooves are formed in the top faces and the bottom faces of the bearing frames, and vacuum adsorption hole plates are arranged on the clamping grooves. The turnover mechanism is connected with the first bevel gears and used for rotating all the first bevel gears at the same time. The vacuum resin hole plugging machine comprises a resin injection assembly located above the bearing frame and an air pump air exhaust assembly located below the bearing frame. The resin hole plugging device can turn over the printed circuit board, and the back drilling holes in the two faces of the printed circuit board are filled with resin, so that cavities are avoided.

Description

technical field [0001] The invention relates to the technical field of printed circuit board processing, in particular to a double-sided back-drilled printed circuit board resin plug hole device and method. Background technique [0002] With the development of printed circuit boards, printed circuit boards often need to design back-drilled holes. Back-drilled holes are to drill part of the copper on the hole wall of the via hole to avoid shielding of the inner layer signal. After the back-drilling process is completed, the hole diameter of the back-drilled part is larger than that of the reserved part. Resin plugging is usually required after the back drilling process is completed. However, when the printed circuit board has back drilling holes on both sides, when the resin plugs the holes, because the back drilling holes on the bottom surface are small at the top and large at the bottom, the resin is filled from the upper part of the hole, which is very difficult. It is di...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 胡志强李清华张仁军杨海军牟玉贵邓岚
Owner 四川英创力电子科技股份有限公司
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