Method for full-automatically assembling supporting piece in backlight source
A technology for supporting parts and backlight sources, applied in the field of backlight sources, can solve the problems of low assembly efficiency, high labor intensity, and easy leakage of assembly and assembly accuracy, and achieve the effect of improving production efficiency and high accuracy
Active Publication Date: 2022-04-22
张云柱
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- Summary
- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0003]
The existing support is manually assembled into the backlight, and the manual assembly of the support has the following problems: low assembly efficiency, high labor intensity, easy to miss assembly and low assembly accuracy
Method used
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[0031] In order to make the technical problems, technical solutions and beneficial effects to be solved, the present application will be described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended to explain the present application and is not intended to limit the present application.
[0032] It should be noted that when the element is referred to as "fixed to" or "set to" another element, it can be directly on the other element or indirectly on the other element. When a component is called "connected to" another element, it can be directly connected to another element or indirectly connected to the other element.
[0033] It is to be understood that the term "length", "width", "upper", "lower", "front", "post", "right", "vertical", "level", "top" , "Bottom", "inside", "outside", etc., the orientation of the orientation is based on the orientation or positional relationship...
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Abstract
A method for full-automatically assembling a supporting piece in a backlight source comprises the steps that the backlight source is provided, the backlight source comprises a PCB substrate and a light-emitting piece, the PCB substrate is provided with a first bonding pad, and the first bonding pad is brushed with solder paste; a supporting piece is provided, the bottom face of the supporting piece is provided with a second bonding pad, the second bonding pad is subjected to tin plating treatment, and the top face of the supporting piece is a plane; placing the supporting piece on the first bonding pad by the chip mounter; putting the backlight source and the supporting piece into a reflow furnace, and melting the solder paste plated on the second bonding pad to be fused with the solder paste on the first bonding pad; and after the solder paste is cooled, the first bonding pad and the second bonding pad are welded and connected. The top surface of the supporting piece is set to be a plane, and the suction nozzle of the chip mounter is in contact with the plane, so that the chip mounter can stably suck the supporting piece, place the supporting piece on the first bonding pad by the chip mounter, then place the supporting piece into a reflow oven to be heated, melt tin paste plated on the second bonding pad and fuse the tin paste on the first bonding pad, and discharge the supporting piece out of the oven to be cooled. And the first bonding pad and the second bonding pad are welded and connected together, so that full-automatic assembling of the supporting piece is completed.
Description
Technical field [0001] The invention belongs to the field of backlight techniques, and more particularly to a method of fully automatic fitting support in a backlight. Background technique [0002] The existing backlight generally includes a substrate and an LED lamp beads disposed on the substrate. When mounting the light guide plate and the diffusion plate, it is easy to hit the LED lamp bead, which is easy to damage the LED lamp bead, so the support is provided on the substrate (ie Anti-collision block), the height of the support is higher than the height of the LED lamp bead. [0003] The existing support is artificially assembled into the backlight. The artificial assembly support has the following problems: the assembly efficiency is low, the intensity of artificial labor is high, and the assembly is not high. Inventive content [0004] It is an object of the present application to provide a method of fully automatically assembling a support in a backlight, aiming to incre...
Claims
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Login to View More IPC IPC(8): B23K1/008
CPCB23K1/008B23K1/0008Y02P70/50
Inventor 张云柱
Owner 张云柱