Testing device and method for radio frequency chip load band S parameter

Abstract

The invention discloses a device and a method for testing an S parameter of a radio frequency chip load tape. The device comprises a workbench; the feeding disc is arranged on the workbench and is used for feeding the radio frequency chip load to be detected; the turret detection mechanism is arranged on the working table and is used for receiving the material loaded by the loading disc and carrying out polarity identification and S parameter measurement on the radio frequency chip load; the industrial personal computer is arranged on the workbench and is in electrical control connection with the feeding disc and the turret detection mechanism; the turret detection mechanism comprises a rotating and turret module, and a first positioning module, a second positioning module, a reversing module, a third positioning module, a shaping and reversing module, a test module and a fourth positioning module which are arranged on the workbench and are sequentially arranged in the rotating direction of the rotating and turret module; the downward-looking CCD modules are arranged in one-to-one correspondence with the first positioning module, the second positioning module and the reversing module, and the blowing modules are arranged on the workbench and are arranged in one-to-one correspondence with the second positioning module and the third positioning module.

Description

technical field [0001] The invention relates to the technical field of radio frequency chip load detection, in particular to a test device and method for radio frequency chip load with S parameters. Background technique [0002] As a special type of product among chip resistors, radio frequency chip loads are mainly used in radar, communication, radio frequency modules and other fields. With the development of scientific information technology and the full deployment of 5G communication technology, the demand for miniaturization in aerospace communication and other fields has increased, and the demand for radio frequency chip loads is increasing. The difference between the RF chip load and the conventional chip resistor is that the bottom electrode of the RF chip load is asymmetrical and has polar components. The bottom electrode of the RF chip load needs to correspond to the polarity mark on the front. However, the conventional chip resistor testing and packaging technolog...

AI Technical Summary

Problems solved by technology

The conventional chip resistor testing packaging technology does not have the function of identifying the corresponding relationship

[0003] In addition, since there is no special testing equipment in the existing technology, domestic RF chip load manufacturers mostly adopt conventional chip resistor automatic testing and packaging technology, which only recognizes the front polarity mark, and at the same time, manually samples the S parameters through the network analyzer in the previous process. test package

This method has the risk of incorrect polarity identification. At the same time, the S parameter is used as the core technical index of the RF chip load, which requires 100% testing to ensure the high reliability of the index. It is far from high-end manufacturing only through random testing and manufacturing processes. field requirements

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