Machine vision inspection equipment and method for PCB circuit welding spots
A technology of machine vision and inspection equipment, which is applied in the direction of instruments, scientific instruments, measuring devices, etc., and can solve problems such as the illusion of qualified solder joints on PCB lines
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Embodiment 1
[0058] like figure 1 As shown, a machine vision inspection equipment for PCB circuit solder joints proposed by the present invention includes:
[0059] The adjustment base 400 and the adjustable base 300 for adjusting the inclination of the adjustment base 400. The upper side of the adjustable base 300 is provided with an accommodating groove for the adjustment base 400 to accommodate. When performing a vertical projection of the PCB horizontal state, the adjustable base 300 and the adjustment The seat 400 is at the same level;
[0060] The adjustable base 300 is provided with a casing 100; the adjustable base 300 and the casing 100 constitute the main part of the frame of the inspection equipment.
[0061] The adjustment seat 400 is provided with a PCB positioning seat 700 for positioning the PCB; the PCB positioning seat 700 is provided with a positioning pin for positioning the PCB; the PCB is located in the PCB positioning seat 700 in a horizontal state;
[0062]It also ...
Embodiment 2
[0082] like Figure 12 As shown, the present invention also proposes a machine vision inspection method for PCB circuit solder joints, which utilizes the above-mentioned machine vision inspection equipment for PCB circuit solder joints to obtain PCB preprocessing information of external control terminal equipment, which specifically includes the following steps;
[0083] S100: Obtain multi-angle simulated image information of solder joints after PCB circuit soldering;
[0084] In S100, the multi-angle simulated image information of the solder joints after PCB circuit soldering includes expected PCB circuit solder joint image information, solder joint position information, solder joint saturation information, and projection area information of the solder joints after PCB angle adjustment.
[0085] S200: Obtain the first image of the solder joints of the PCB circuit through an industrial vision camera, and compare the first image with the simulated image;
[0086] This comparis...
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