Double-layer circuit board welding method
A technology of double-layer circuit board and welding method, which is applied in multi-layer circuit manufacturing, printed circuit, printed circuit manufacturing, etc., can solve problems such as easy adhesion or virtual welding, and achieve the effect of solving adhesion and virtual welding and reducing difficulty
Pending Publication Date: 2022-04-22
深圳市潜力创新科技有限公司
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Problems solved by technology
[0003] The main purpose of the present invention is to propose a double-layer circuit board welding method, which aims to solve the problem of easy adhesion or virtual welding in the current double-layer circuit board maintenance welding
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[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0025] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.
[0026] In addition, if there are descriptions involving "first", "second" and ...
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Abstract
The invention provides a double-layer circuit board welding method. The double-layer circuit board welding method comprises the steps that a first bonding pad area and a second bonding pad area are cleaned; tin paste is smeared on the multiple first welding spots; placing at least three supporting pieces which are not on the same straight line at the first bonding pad area, wherein each supporting piece is located at one first welding spot; the first bonding pad area is heated to melt the solder paste into a solder ball, and the supporting piece is fused into the solder ball; stacking a second circuit board on the first circuit board, and enabling the second bonding pad area to directly face the first bonding pad area; and heating the first circuit board and / or the second circuit board, and pressing the second circuit board to the first circuit board, so that the solder balls are melted and the corresponding first welding spots and second welding spots are welded. According to the technical scheme, the problem that adhesion or pseudo soldering is prone to occurring when the double-layer circuit board is maintained and welded can be solved.
Description
technical field [0001] The invention relates to the field of welding technology, in particular to a double-layer circuit board welding method. Background technique [0002] As an essential part of electronic products, the circuit board is the basis for the work of various electronic devices in electronic products, and it is also the part that occupies the largest space in electronic products. With the increasing miniaturization and high integration requirements of electronic products, double-layer circuit boards with higher density of electronic components have emerged as the times require. The double-layer circuit board is welded by two circuit boards, and electronic devices are welded on each circuit board, so within a unit volume, the double-layer circuit board can provide more welding interfaces for electronic devices. For assemblers using large-scale and standardized electronic equipment, it is not difficult to use standard welding methods, fixed welding temperature an...
Claims
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Login to View More IPC IPC(8): H05K3/46H05K1/11
CPCH05K3/4614H05K1/11
Inventor 杨长顺张志衡薛仁峰张阳
Owner 深圳市潜力创新科技有限公司