A kind of MTC thyristor module packaging structure and packaging method
A technology of module packaging and packaging method, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of high wire solder joint void rate, affecting product quality, low solder joint strength, etc., to achieve solder voids Low rate, prevent separation or cracking, and reduce the effect of chip junction temperature
Active Publication Date: 2022-07-01
尼尔半导体(山东)有限公司
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Problems solved by technology
[0004] The object of the present invention is to: provide a kind of MTC thyristor module packaging structure and its packaging method, to solve the above-mentioned background technology when the thyristor is packaged, because the thyristor module as a whole is relatively small, in realizing welding each element When connecting wires between devices, it is easy to make the void rate of the solder joints of the wires large, the strength of the solder joints is low, and it is easy to cause cracks or solder joints to fall off, which affects the quality of the product.
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[0041] In order to make those skilled in the art better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only The embodiments are part of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present application.
[0042] It should be noted that the terms "first", "second" and the like in the description and claims of the present application and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeabl...
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The invention discloses a packaging structure of an MTC thyristor module and a packaging method thereof, and relates to the technical field of semiconductors. The packaging structure comprises: a base, a silica gel protective layer, a polar S-shaped wire, an auxiliary support and a casing; The components in the fixed module include the chip; the silicone protective layer covers the chip; the PCB conductive copper foil circuit board is fixed directly above the chip through the S-shaped support; the polar S-shaped wire is connected to both ends with solid state A tin sheet; an auxiliary support, which includes an elastic arc sheet and an interference sleeve fixed on both ends of the elastic arc, and the interference sleeve is provided with a sleeve hole for the polar S-shaped wire to pass through. The interference sleeve of the invention can "shape" the molten solid tin sheet so that the solder joint is formed into a truncated cone shape, and in the cooling process, it can not only form a thermal insulation layer to cover the outside of the solder joint to prevent the solder joint from being separated or cracked, but also It can discharge the air bubbles in the liquefied tin, and the welding void rate is small.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to an MTC thyristor module packaging structure and a packaging method thereof. Background technique [0002] The thyristor is the abbreviation of the thyristor rectifier element. It is a high-power semiconductor device with a four-layer structure with three PN junctions, also known as a thyristor. It has the characteristics of small size, relatively simple structure and strong function. One of the commonly used semiconductor devices. [0003] At present, when the thyristor is packaged, because the thyristor module is relatively small as a whole, when welding wires between various components, it is easy to make the porosity of the wire solder joints large, the solder joint strength is low, and it is easy to cause cracking or solder joints fall off. , resulting in poor packaging quality, and has different degrees of influence on the heat dissipation and conduction of component...
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IPC IPC(8): H01L23/31H01L23/49H01L21/50H01L21/52H01L21/60H01L21/56
CPCH01L23/3107H01L23/49H01L21/50H01L21/52H01L24/48H01L24/85H01L21/56H01L2224/48091H01L2224/8509H01L2224/85801H01L2224/8584
Inventor 王伟格金加晋王稚程赵廷唯
Owner 尼尔半导体(山东)有限公司