Method and system for detecting device defects using x-ray

Abstract

In an embodiment, an automatic high-speed X-ray detection system generates a first X-ray image of a detected sample in a first direction that may be substantially orthogonal to a plane of the detected sample. The first X-ray image may be a high resolution grayscale image. The system may identify one or more elements of interest of the detected sample based on the first X-ray image. The first X-ray image may include interfering elements that interfere with one or more elements of interest in the first X-ray image. The system may determine one or more first features associated with the respective elements of interest based on changes in gray values in the first X-ray image. The system may determine whether one or more defects are associated with a respective element of interest based on one or more first features associated with the element of interest.

Description

technical field [0001] The present invention relates to high-speed inspection and inspection of objects using X-rays. Background technique [0002] Integrated circuits can be fabricated to include 3D or 2.5D structures. Since the optical photons or electrons used to inspect silicon wafers cannot penetrate ICs, interposers, or Cu-Cu dies for die bonding to provide an adequate view of the interior of packaged ICs, optical Inspection techniques that photonically or electronically inspect silicon wafers cannot be used to inspect 3D and 2.5D IC packages. Optical inspection methods also cannot inspect or metrology partially encapsulated components, a key requirement for process control. Since X-rays can penetrate multilayer packages, X-ray inspection can provide an internal view of assembled devices. [0003] However, existing X-ray systems lack sufficient resolution and imaging speed to meet the needs of high-resolution, high-throughput IC and electronic package inspection. F...

AI Technical Summary

Problems solved by technology

[0003] However, existing X-ray systems lack sufficient resolution and imaging speed to meet the needs of high-resolution, high-throughput IC and electronic package inspection

For example, traditional computed tomography (CT) using X-rays may take multiple X-ray image slices of the inspected object and use a large number of slices to build a 3D model of the object, so it is very slow and unsuitable for IC inspection

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