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Method and system for defect detection and classification using x-ray

A detection system, X-ray technology, applied in the direction of material analysis using radiation, material analysis using wave/particle radiation, radiation intensity measurement, etc., can solve the problem of slow integrated circuit detection, lack of resolution and imaging speed of X-ray systems And other issues

Pending Publication Date: 2022-04-26
BRUKER NANO INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, existing X-ray systems lack sufficient resolution and imaging speed to meet the needs of high-resolution, high-throughput IC and electronic package inspection
For example, traditional computed tomography (CT) using X-rays may take multiple X-ray image slices of the inspected object and use a large number of slices to build a 3D model of the object, so it is very slow and unsuitable for IC inspection

Method used

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  • Method and system for defect detection and classification using x-ray
  • Method and system for defect detection and classification using x-ray
  • Method and system for defect detection and classification using x-ray

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Embodiment Construction

[0018] Automatic high-speed X-ray inspection system

[0019] X-ray system frame

[0020] The systems and methods disclosed herein relate to a system or use of a system that illuminates an object to be inspected or inspected with X-rays that convert the X-rays into visible (or near-visible) photons, forming visible (or near-visible) photons images, and then convert the images into electronic form. Accordingly, various embodiments of the X-ray imaging system will be described first, followed by various embodiments of methods and systems utilizing the X-ray imaging system.

[0021] Although a wide variety of objects may be inspected or inspected using the apparatus disclosed herein, it is contemplated that it is particularly applicable to the inspection and inspection of integrated circuit wafer and package assemblies. One example of this is a silicon interposer, including silicon with multiple TSVs, but the invention can also be used to inspect integrated circuits (ICs) th...

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PUM

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Abstract

In an embodiment, an automatic high-speed X-ray detection system may identify a reference object of an object of interest to be detected. Each reference object may have the same type and component as the object of interest. The system may generate a reference model of the object of interest based on an X-ray image of a reference object. The system may determine whether the object of interest is associated with one or more defects by comparing an X-ray image of the object of interest to a reference model. Defects may be characterized by one or more predetermined defect models and may be divided into respective defect categories based on the predetermined defect models.

Description

technical field [0001] The present invention relates to high-speed inspection and inspection of objects using X-rays. Background technique [0002] Integrated circuits can be fabricated to include 3D or 2.5D structures. Since the optical photons or electrons used to inspect silicon wafers cannot penetrate ICs, interposers, or Cu-Cu dies for die bonding to provide an adequate view of the interior of packaged ICs, optical Inspection techniques that photonically or electronically inspect silicon wafers cannot be used to inspect 3D and 2.5D IC packages. Optical inspection methods also cannot inspect or metrology partially encapsulated components, a key requirement for process control. Since X-rays can penetrate multilayer packages, X-ray inspection can provide an internal view of assembled devices. [0003] However, existing X-ray systems lack sufficient resolution and imaging speed to meet the needs of high-resolution, high-throughput IC and electronic package inspection. F...

Claims

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Application Information

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IPC IPC(8): G06T7/00G06K9/62G06N20/00G06V10/774
CPCG06T7/001G06N20/00G06T7/0012G06T7/0014G06T2207/30148G06T2207/30004G06T2207/30141G06T2207/30152G06F18/24G06F18/214G01N23/04G01N2223/401G01N2223/505G01N2223/6466G01T1/20G06N20/20G06T2207/10016G06T2207/10116G06T2207/20081G06V10/82G06V2201/06G06N5/01G06N3/045G01N23/043G01N23/083G01N23/18G06F30/398H05K1/115H05K3/4038H01L21/67288G01N2223/04G01N2223/426G06T2207/10081G06T2207/20024G06T2207/20208G06F2115/12G06F2119/18G06T5/90
Inventor 大卫·刘易斯·阿德勒弗雷迪·埃里希·巴比安
Owner BRUKER NANO INC
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