Product fault prediction method and system based on X-ray image reinspection

A detection system, X-ray technology, applied in image enhancement, image analysis, radiation intensity measurement, etc., can solve problems such as high cost for manufacturers and product failures

Pending Publication Date: 2022-05-06
BRUKER NANO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after a period of use in field applications, some products may malfunction in some way
Faulty products can trigger a recall involving a large number of products and can be costly for the manufacturer

Method used

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  • Product fault prediction method and system based on X-ray image reinspection
  • Product fault prediction method and system based on X-ray image reinspection
  • Product fault prediction method and system based on X-ray image reinspection

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Embodiment Construction

[0015] Automatic high-speed X-ray inspection system

[0016] X-ray system frame

[0017] The systems and methods disclosed herein relate to a system or use of a system that illuminates an object to be inspected or inspected with X-rays that convert the X-rays into visible (or near-visible) photons, forming visible (or near-visible) photons images, and then convert the images into electronic form. Accordingly, various embodiments of the X-ray imaging system will be described first, followed by various embodiments of methods and systems utilizing the X-ray imaging system.

[0018] Although a wide variety of objects may be inspected or inspected using the apparatus disclosed herein, it is contemplated that it is particularly applicable to the inspection and inspection of integrated circuit wafer and package assemblies. One example of this is a silicon interposer, including silicon with multiple TSVs, but the invention can also be used to inspect integrated circuits (ICs) th...

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PUM

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Abstract

In an embodiment, an X-ray detection system may access a first set of X-ray images of one or more first samples marked as unqualified. The system may adjust a classification algorithm based on the first set of X-ray images. A classification algorithm may classify the sample into qualified or unqualified categories based on analysis of the respective X-ray images. The system may analyze a second set of X-ray images of a second plurality of samples using the adjusted classification algorithm. The second sample may be a previously detected sample classified as qualified by the classification algorithm during a previous analysis prior to adjusting the classification algorithm. The system may identify one or more of the second samples from a second set of X-ray images. Each identified second sample may be classified as unqualified by the adjusted classification algorithm.

Description

technical field [0001] The invention relates to product inspection based on X-ray images. Background technique [0002] Integrated circuits can be fabricated to include 3D or 2.5D structures. Since the optical photons or electrons used to inspect silicon wafers cannot penetrate ICs, interposers, or Cu-Cu dies for die bonding to provide an adequate view of the interior of packaged ICs, optical Inspection techniques that photonically or electronically inspect silicon wafers cannot be used to inspect 3D and 2.5D IC packages. Optical inspection methods also cannot inspect or metrology partially encapsulated components, a key requirement for process control. Since X-rays can penetrate multilayer packages, X-ray inspection can provide an internal view of assembled devices. [0003] Products, including integrated circuits or components, are ready for field application after passing quality control tests and inspections. However, after a period of use in field applications, some...

Claims

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Application Information

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IPC IPC(8): G06T7/00G06V10/74G06V10/764G06K9/62G01T1/20G01N23/083G01N23/18G01N23/04
CPCG06T7/0004G01N23/04G01N23/043G01N23/083G01N23/18G01T1/20G06T2207/10116G06T2207/20081G06T2207/30148G01N2223/04G01N2223/401G01N2223/426G01N2223/505G01N2223/6466G06F18/22G06F18/24G06N20/20G06T7/001G06T2207/10016G06T2207/30141G06T2207/30152G06V10/82G06V2201/06G06N5/01G06N3/045G06F18/214G06F30/398G06N20/00H05K1/115H05K3/4038H01L21/67288G06T2207/10081G06T2207/20024G06T2207/20208G06T2207/30004G06F2115/12G06F2119/18G06T5/90G06T7/0012G06T7/0014
Inventor 大卫·刘易斯·阿德勒斯科特·约瑟夫·朱勒道格拉斯·A.·克里斯桑
Owner BRUKER NANO INC
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