Laser processing method and laser processing system for packaging substrate
A laser processing method and laser processing technology, applied in metal processing, laser welding equipment, metal processing equipment, etc., can solve the problems of low efficiency, low yield rate, and low processing accuracy, and achieve high groove width accuracy and high yield rate , the effect of high processing precision
Pending Publication Date: 2022-05-03
HANS LASER TECH IND GRP CO LTD
View PDF8 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0006] The purpose of the embodiments of the present invention is to solve the technical problems of low processing precision, low efficiency, and low yield rate in the existing preparation method of the stepped groove of the package substrate.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention; the terms used in the specification herein are only for the purpose of describing specific embodiments, and are not intended to To limit the invention, for example, the terms "length", "width", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top ", "bottom", "inner", "outer" and other indicated orientations or positions are based on the orientations or positions shown in the drawings, which are only for convenience of description and cannot be understood as limitations on the technical solution.
[0042] The terms "include" and "have" in the specification and claims of the present invention and the description of the above drawings, as well as any variations thereof, are intended to cover a non-exclusive inclusion; The terms "first", "second", etc. are used t...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention belongs to the technical field of laser processing, and relates to a laser processing method and a laser processing system for a packaging substrate, and the packaging substrate comprises an insulating layer and a copper-clad layer which are stacked; the laser processing method comprises the following steps that according to a first processing track, a first laser beam is adopted to process a first groove in an insulating layer in the direction from the insulating layer to a copper-clad layer; according to a second processing track, sequentially carrying out at least two times of layered processing on the insulating layer at the groove bottom of the first groove by adopting a laser beam group so as to process a second groove, and exposing the copper-clad layer; wherein the laser processing parameter of the first laser beam is a first laser processing parameter; the laser processing parameter of each laser beam in the laser beam group is different from the first laser processing parameter; the cross section area of the first groove is larger than that of the second groove. According to the technical scheme provided by the laser processing method and the laser processing system for the packaging substrate, processing scraps left on the copper-clad layer can be reduced, and damage to the copper-clad layer in the processing process is effectively avoided.
Description
technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser processing method and a laser processing system for a packaging substrate. Background technique [0002] Circuit boards are used as supports for electronic components. Copper cladding on the circuit board can improve the anti-noise ability, reduce the potential difference, reduce the ground wire impedance, etc. [0003] In order to fill the insulating layer on the copper-clad packaging substrate with conductive material, it is necessary to open a stepped groove for the insulating layer on the copper-clad packaging substrate. At present, the commonly used preparation methods for step grooves of packaging substrates are mainly divided into two categories: one is a series of mechanical processing such as milling and drilling with mechanical tools; the other is secondary lamination of multi-layer plates. [0004] The preparation method of mechanical processing has ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): B23K26/36B23K26/352B23K26/70B23K37/04
CPCB23K26/36B23K26/3576B23K26/702B23K37/0461B23K2101/42
Inventor 房用桥谢圣君王昌焱徐新峰罗华侨夏炀恒范祥鑫曾晶龙伟张董洁李士杰邓军凯吕启涛高云峰
Owner HANS LASER TECH IND GRP CO LTD