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Annular distributed semiconductor equipment

A semiconductor and distributed technology, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of increased wafer production cost and limited semiconductor equipment output, to enhance multi-cavity processing capacity and improve operation convenience Applicability and applicability, the effect of expanding the scope of application

Pending Publication Date: 2022-05-06
上海普达特半导体设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a ring-shaped distributed semiconductor equipment, which is used to solve the problems of limited output of semiconductor equipment and increased cost of wafer output in the prior art

Method used

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  • Annular distributed semiconductor equipment
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  • Annular distributed semiconductor equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Such as figure 2 As shown, this embodiment provides a ring-shaped distributed semiconductor device, the semiconductor device includes: a front-end module, a reaction chamber module and a transmission module, wherein the front-end module includes transfer stations 511, 512; the reaction chamber module includes 8 reaction chambers 610, and the 8 reaction chambers 610 and the 2 transfer platforms 511, 512 are arranged in a ring; the transmission module is located inside the ring distribution, and the transmission module adopts a rotating part, so The rotating member adopts a disc-type rotating disc 810, and four mechanical arms 710 are installed on the disc-type rotating disc 810. Through the rotating operation of the disc-type rotating disc 810, the wafer is placed in the transit The transmission is carried out in the stages 511, 512 and the reaction chamber 610.

[0046] In this embodiment, the value N of the repeater station is N=2, but it is not limited thereto. In a...

Embodiment 2

[0057] Such as image 3 As shown, this embodiment provides a ring-shaped distributed semiconductor device. The main difference between this embodiment and Embodiment 1 is that in the semiconductor device, the rotating member adopts a bracket-type rotating frame 820. Specifically, The semiconductor equipment includes:

[0058] A front-end module, a reaction chamber module and a transmission module, wherein the front-end module includes transfer stations 521, 522; the reaction chamber module includes 8 reaction chambers 620, and 8 reaction chambers 620 and 2 transfer stations 521, 522 are distributed in a ring; the transmission module is located inside the ring distribution, and the transmission module adopts a rotating member, and the rotating member adopts a bracket type rotating frame 820, and is installed on the bracket type rotating frame 820 There are four robot arms 720 , and the wafers are transported in the transfer tables 521 , 522 and the reaction chamber 620 through...

Embodiment 3

[0061] Such as Figure 4 As shown, this embodiment provides a ring-shaped distributed semiconductor device. The difference between this embodiment and Embodiment 1 is that in the semiconductor device, the transfer stations 531, 532, and 533 are mobile transfer stations. The operation of the mobile transfer table, the mobile transfer table can complete the front-end wafer transfer process and the mid-end wafer transfer process. Specifically, the semiconductor equipment includes:

[0062] A front-end module, a reaction chamber module and a transmission module, wherein the front-end module includes the transfer platforms 531, 532 and 533; the reaction chamber module includes 8 reaction chambers 630, and 8 reaction chambers 630 and 3 The transfer platforms 531, 532, 533 are distributed in a ring; the transmission module is located inside the ring distribution, and the transmission module adopts a rotating member, and the rotating member adopts a disc-type rotating disk 830, and in...

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Abstract

The invention provides an annular distributed semiconductor device which comprises a front end module with a transfer table, a reaction cavity module which is provided with a plurality of reaction cavities and is annularly distributed with the transfer table, and a transmission module which is located in the annular distribution, the transmission module comprises a rotating part, a mechanical arm is installed on the rotating part, and through rotation operation of the rotating part, the mechanical arm is driven by the rotating part to rotate. And transmitting the wafer in the transfer table and the reaction cavity. According to the annular distributed semiconductor equipment, the operation convenience and applicability of the semiconductor equipment can be improved, the layout of the semiconductor equipment is simplified, the equipment size is reduced, the equipment cost is reduced, wafer transferring, taking and placing operations in a plurality of process cavities can be processed at the same time, the multi-cavity processing capacity of the semiconductor equipment is greatly enhanced, and the productivity is greatly improved.

Description

technical field [0001] The invention belongs to the field of semiconductor equipment and relates to an annular distributed semiconductor equipment. Background technique [0002] In the field of semiconductor equipment, multi-chamber wafer processing equipment is a common equipment in semiconductor manufacturing. It generally includes a front-end module for loading wafers to be processed, a wafer transfer module for transferring wafers, and processing of wafers. The reaction chamber module composed of multiple wafer reaction chambers is an integrated semiconductor production machine. [0003] In an integrated semiconductor production machine, multiple reaction chambers used for processing wafers are usually distributed symmetrically along a straight line on the horizontal plane, and index tracks are provided at the symmetrical axis positions of the symmetrically distributed reaction chambers. The manipulator for transporting the wafer is fixed on the index track, so that the...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67167H01L21/67196
Inventor 黄允文刘二壮刘枫蔡斌刘涛
Owner 上海普达特半导体设备有限公司