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Adjusting assembly, reaction cavity device and microwave plasma vapor deposition system

A technology for adjusting components and reaction chambers, applied in gaseous chemical plating, metal material coating process, coating, etc., can solve problems such as difficulty in adapting to the parts to be coated, fixed size, etc., and achieve the effect of increasing the scope of use

Active Publication Date: 2022-05-10
成都纽曼和瑞微波技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the size of the existing reaction chamber is generally fixed, and it is difficult to adapt to rod-shaped parts to be coated with different lengths.

Method used

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  • Adjusting assembly, reaction cavity device and microwave plasma vapor deposition system
  • Adjusting assembly, reaction cavity device and microwave plasma vapor deposition system
  • Adjusting assembly, reaction cavity device and microwave plasma vapor deposition system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Please refer to Figure 1-Figure 3 , the present embodiment provides a reaction chamber device 100 , which includes a reaction chamber housing 110 , an adjustment assembly 120 is provided at one end of the reaction chamber housing 110 and a blocking assembly 140 is provided at the other end. The adjusting assembly 120 is used to adjust the length of the inner space of the reaction chamber housing 110 , and the blocking assembly 140 is detachably connected to the reaction chamber housing 110 , so as to facilitate putting the rod 200 to be coated into the reaction chamber housing 110 .

[0040] Specifically, the reaction chamber housing 110 is a cuboid cavity structure formed by connecting four rectangular steel plates; a rectangular through hole is provided in the middle of one of the steel plates. A rectangular tubular microwave transmission component 190 is disposed at the rectangular through hole, and the microwave transmission component 190 is connected to the reacti...

Embodiment 2

[0057] Please refer to Figure 6 and Figure 7 , this embodiment provides another reaction chamber device 100, which differs from the reaction chamber device 100 in Embodiment 1 in that both ends of the reaction chamber housing 110 of the reaction chamber device 100 in this embodiment are provided with adjustment components 120.

[0058] The adjustment assembly 120 at one end of the above-mentioned reaction chamber device 100 has the same structure as that in Embodiment 1, and an air intake assembly 130 of the same structure is also provided; the middle part of the adjustment assembly 120 at the other end is provided with a lifting rod 180, and the lifting rod 180 can be moved from The adjustment assembly 120 is disassembled, so as to facilitate the loading and unloading of the rod 200 to be coated. For ease of description, the adjustment assembly 120 provided with the lifting rod 180 is referred to as the second adjustment assembly 120 , and the other adjustment assembly 12...

Embodiment 3

[0063] This embodiment provides a microwave plasma vapor deposition system, which includes a microwave source, a microwave transmission component, and the reaction chamber device 100 in Embodiment 1 or 2; the microwave source is connected to the microwave transmission component 190 through the microwave transmission component, so that The microwave can enter the reaction cavity through the microwave transmission component 190 .

[0064] Since both the microwave source and the microwave transmission component can adopt existing structures, they will not be described in detail.

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Abstract

The invention provides an adjusting assembly, a reaction cavity device and a microwave plasma vapor deposition system, and belongs to the field of microwave plasmas. The reaction cavity device comprises a reaction cavity shell, one end of the reaction cavity shell is provided with an adjusting assembly, and the other end of the reaction cavity shell is provided with a plugging assembly; or adjusting assemblies are arranged at the two ends of the reaction cavity shell. The adjusting assembly comprises a sliding block, and the sliding block is inserted into the reaction cavity shell in a sliding manner and can be fixed at a preset position; a closed cavity can be formed in the reaction cavity shell. When the coating device is used, the plugging assembly is opened firstly, and a rod piece to be coated is put into the reaction cavity shell; and then the length space in the reaction cavity shell is adjusted by properly moving the sliding block of the adjusting assembly, so that the internal space of the reaction cavity shell is matched with the length of the rod piece to be coated. Due to the arrangement of the adjusting assembly, the reaction cavity device can adapt to rod pieces to be coated with different lengths within a certain range, and the application range of the reaction cavity device is widened.

Description

technical field [0001] The invention relates to the field of microwave plasma equipment, in particular to an adjustment component, a reaction chamber device and a microwave plasma vapor deposition system. Background technique [0002] Microwave plasma CVD (Microwave PCVD, MPCVD) uses the microwave waveguide generated by the microwave generator to enter the reaction chamber through the isolator, and feeds the mixed gas of CH4 and H2. Under the excitation of the microwave, a glow is generated in the reaction chamber The discharge ionizes the molecules of the reactive gas, generates plasma, and deposits a diamond film on the substrate. However, the size of the existing reaction chamber is generally fixed, and it is difficult to adapt to rod-shaped parts to be coated with different lengths. Contents of the invention [0003] The object of the present invention is to provide an adjustment assembly and a reaction chamber device, the inner space of the reaction chamber shell can...

Claims

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Application Information

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IPC IPC(8): C23C16/511C23C16/52
CPCC23C16/511C23C16/52
Inventor 黄春林陈森林李俊宏季宇
Owner 成都纽曼和瑞微波技术有限公司
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