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Ceramic electronic component

A technology of electronic components and ceramics, which is applied in the field of ceramic electronic components and can solve problems such as moisture resistance or deterioration of mechanical strength characteristics

Pending Publication Date: 2022-05-10
TDK CORPARATION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When cracks exist inside the element body, the characteristics as electronic components such as moisture resistance and mechanical strength deteriorate, so it becomes a problem

Method used

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  • Ceramic electronic component
  • Ceramic electronic component
  • Ceramic electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0107] (sample 1)

[0108] In Sample 1, using a Figure 4 For the lead terminal 8 having the tip shape shown, 30 capacitor samples were produced, and the rate of occurrence of cracks was evaluated.

[0109] First, as the capacitor body 4 , a capacitor chip having a length of 1.6 mm in the X-axis direction, a width of 0.8 mm in the Y-axis direction, and a height L0 of 0.8 mm in the Z-axis direction was prepared. Then, terminal electrodes 6 composed of a Cu sintered electrode layer, Ni plating and Sn plating were formed on the capacitor chip.

[0110] In addition, as a raw material of the lead terminal 8, a Cu wire having a wire diameter of 0.5 mm and having a tin-plated layer formed on the surface was prepared. Then, the Cu wire is processed into Figure 4 The shape shown is soldered to the capacitor chip according to the steps shown in the embodiment. The detailed dimensions of the actually used lead terminals 8 are as follows. In addition, the following dimensions are av...

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Abstract

A ceramic electronic component according to the present invention is provided with: a ceramic element body having an end surface along a first axis and a side surface along a second axis intersecting the end surface; an end surface electrode formed on an end surface of the ceramic element body; and a lead terminal joined to the end surface electrode by solder. The lead terminal has: an adjacent portion that overlaps the end surface electrode in a side view from a direction along the second axis; and an extending portion extending from an end portion of the adjacent portion in a direction away from a surface including the side surface. Furthermore, a first recessed portion, which is recessed in a direction away from a surface including the end surface, is formed in the extension portion, and the first recessed portion is located at a position close to the end portion of the adjacent portion.

Description

technical field [0001] The invention relates to a ceramic electronic component with lead terminals. Background technique [0002] A ceramic electronic component with lead terminals as disclosed in Patent Document 1 is known as an electronic component mounted on a circuit board or the like. In this ceramic electronic component, lead terminals are usually joined to a ceramic body on which terminal electrodes are formed using solder. Specifically, soldering of the terminal electrodes is performed by sandwiching the ceramic body between a pair of lead terminals and dipping in a solder bath in this state as disclosed in Patent Document 1. [0003] At this time, a rounded corner is formed between the lead terminal and the terminal electrode by wetting and spreading of the solder. At the end of the ceramic body in contact with the fillet, shrinkage stress is generated when the solder solidifies, and cracks are likely to occur inside the body. When cracks exist inside the element...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/228
CPCH01G4/228H01G4/232H01G4/30H01G4/2325H01G2/06H01G4/008H01G4/012
Inventor 森雅弘增田朗丈伊藤信弥安藤德久
Owner TDK CORPARATION