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Double ferroelectric gate transistor based on two-dimensional semiconductor channel

A two-dimensional semiconductor and transistor technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, circuits, etc., to achieve the effect of non-volatile retention

Pending Publication Date: 2022-05-10
XIDIAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, limited by its single-gate structure, ferroelectric field-effect two-dimensional transistors that can realize single-transistor Boolean logic gates have not been reported yet.

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  • Double ferroelectric gate transistor based on two-dimensional semiconductor channel
  • Double ferroelectric gate transistor based on two-dimensional semiconductor channel

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Embodiment Construction

[0022] In order to make the objects and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0023] refer to figure 1 , the dual ferroelectric gate two-dimensional transistor in the present invention includes: a substrate 1, a bottom gate electrode 2, a bottom ferroelectric layer 3, a two-dimensional semiconductor channel layer 4, a source 5, a drain 6, a top ferroelectric layer 7, Top gate electrode 8 . The substrate 1 uses SiO 2 material, the bottom gate electrode 2, the top gate electrode 8, the source electrode 5 and the drain electrode 6 are all made of metal Au material; the bottom ferroelectric layer 3 and the top ferroelectric layer 7 are all made of P(VDF-TrFE) material; the two Dimensional semic...

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Abstract

The invention discloses a double-ferroelectric-gate transistor based on a two-dimensional semiconductor channel. The defect of a traditional ferroelectric field effect two-dimensional transistor in the in-memory calculation aspect is overcome. Comprising a top gate electrode layer, a top ferroelectric layer, a two-dimensional semiconductor channel layer, a bottom ferroelectric layer and a bottom gate electrode layer which are vertically distributed on a substrate from top to bottom in sequence; the source electrode and the drain electrode are located on the two sides of the top ferroelectric layer respectively. The bottom gate electrode layer, the drain electrode layer, the source electrode layer and the top gate electrode layer are made of metal Au materials, the two-dimensional semiconductor channel layer is made of MoS2 or MoTe2 materials, and the bottom ferroelectric layer and the top ferroelectric layer are made of P (VDF-TrFE) materials. According to the invention, the TMDC channel is electrically regulated and controlled through the coupling effect of the double ferroelectric gates, and the non-volatile conductivity of the TMDC channel is adjusted. Meanwhile, the double-ferroelectric-grid two-dimensional transistor adopts independent polarization of an upper ferroelectric layer and a lower ferroelectric layer as two logic inputs, double-input Boolean storage logic operation and non-volatile maintenance of a logic state of the double-input Boolean storage logic operation can be achieved according to four different combinations of polarization directions in the double ferroelectric grids, and therefore the function of in-memory calculation is achieved.

Description

technical field [0001] The invention belongs to the technical field of microelectronic devices, and in particular relates to a double ferroelectric gate two-dimensional transistor that can use a single transistor structure to realize in-memory computing, which helps to promote the next generation of in-memory computing devices with high energy efficiency ratio and high area efficiency development of. Background technique [0002] With the emergence of emerging smart applications such as artificial intelligence Internet of Things (AIoT), robotics, and edge computing, the information processing system of smart devices needs to process massive unstructured data in real time and efficiently. However, due to the bottleneck of the "memory wall" of the traditional von Neumann architecture, the traditional information processing system has been difficult to meet the data-intensive computing needs of current smart devices. In-memory computing is a technical solution proposed to solv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/78H01L21/34
CPCH01L29/78391H01L29/7831H01L29/66969
Inventor 刘艳罗拯东杨麒玉檀东昕韩根全郝跃
Owner XIDIAN UNIV