Low-cost and high-bandwidth packaging substrate structure and optical module

Abstract

The invention provides a low-cost and high-bandwidth packaging substrate structure and an optical module. The low-cost and high-bandwidth packaging substrate structure comprises a substrate; the circuit structures are arranged on the substrate in parallel; the circuit structure comprises a grounding layer, a first signal line layer, a high-frequency impedance matching circuit and a heating circuit which are arranged on a substrate, the grounding layer separates the first signal line layer, the high-frequency impedance matching circuit and the heating circuit, and gaps exist between the layers. A laser close to the edge of the substrate is mounted on the grounding layer; the high-frequency impedance matching circuit and the first signal line layer are oppositely arranged on the two sides of the laser; the heating circuit is arranged on the lower sides of the high-frequency impedance matching circuit and the laser; the high-frequency impedance matching circuit comprises a first metal layer and a second metal layer which are arranged at an interval; a first resistor is bridged between the first metal layer and the second metal layer; a filter capacitor is bridged between the second metal layer and the grounding layer; the first metal layer, the first signal line layer and the upper surface of the laser are connected through arranged gold threads.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a low-cost and high-bandwidth packaging substrate structure and an optical module. Background technique [0002] At present, with the rapid development of emerging applications such as autonomous driving, data centers, and metaverses, single-channel transmission rates are gradually increasing, single-channel 25G Baud and 50G Baud have been gradually applied in batches, and higher-speed lasers are gradually being used in the industry chain. roll out. Generally, the laser in the optical device or optical module is connected to the PCB board by means of the substrate or ceramic housing below it. The higher bandwidth of the packaging substrate structure is more conducive to improving its overall performance. In addition, since the laser needs to work within a certain temperature range to ensure optimal performance, the current 400G and 800G products mostly use TEC (Th...

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Problems solved by technology

In addition, because the laser needs to work within a certain temperature range to ensure optimal performance, the current 400G and 800G products mostly use TEC (ThermoElectric Cooler) to control the temperature, but this solution has the problems of high cost and high power consumption

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