3D printing device and method

A 3D printing and printing platform technology, applied in the field of 3D printing, can solve problems such as restricted application, low degree of fuse bonding, and performance defects of printed parts, so as to achieve the effect of improving performance and reducing the degree of anisotropy

Pending Publication Date: 2022-05-13
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Based on the principle of fuse accumulation, although rapid prototyping can be achieved, the degree of bonding between the fuses is far lower than that of the printing material body, which makes the performance of the printed parts defective and restricts the application of this technology

Method used

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  • 3D printing device and method
  • 3D printing device and method
  • 3D printing device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The ordinary printing platform is used, and the vibration of the platform is not excited.

Embodiment 2

[0028] refer to figure 1 and figure 2 , this embodiment provides a 3D printing device, including: a printing platform 1, two piezoelectric ceramics 2 are arranged below the printing platform 1, and the two piezoelectric ceramics 2 are used to excite the two-phase vibration mode of the printing platform, Through the superposition and combination of the two-phase vibration modes, the particles on the surface of the printing platform generate elliptical motion. The vibration frequency is controlled by controlling the input voltage of the battery ceramic sheet 3. In this embodiment, the effective value of the applied voltage is 40V, and the plateau amplitude is 1 micron.

[0029] It should be noted, figure 2 Among them, X, Y, and Z are three-dimensional coordinates, among which Z is the vertical direction, and P is the stacking and forming direction of 3D printing.

[0030] What needs to be explained here is that the vibration of the piezoelectric ceramic 2 excites the two vi...

Embodiment 3

[0033] The difference between this embodiment and Embodiment 2 is that four pieces of piezoelectric ceramics are installed under the printing platform, the effective value of the applied voltage is 120V, and the amplitude of the platform is 20 microns.

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Abstract

The invention discloses a 3D printing device and method.The 3D printing device comprises a printing platform, a vibration device is arranged below the printing platform, the vibration device is used for exciting two-phase vibration modes of the printing platform, and particles on the surface of the printing platform generate elliptic motion through superposition and combination of the two-phase vibration modes; the vibration device is connected with the printing platform, mass points on the surface of the printing platform generate micron-level elliptical motion through the inverse piezoelectric effect and the resonance effect, the porosity between fuses in fused deposition 3D printing is reduced under the condition that the printing process and the printing precision are not affected, and the performance of printed parts is improved.

Description

technical field [0001] The invention relates to the technical field of 3D printing, in particular to a 3D printing device and method. Background technique [0002] The fused deposition 3D printer is a kind of equipment that uses layering to realize manufacturing. By digitizing the workpiece and using special slicing software, a file format with path information is generated, and the file is imported into the 3D printer. The print head will melt Resin is extruded and stacked according to the set path to achieve rapid prototyping. [0003] Fused deposition 3D printing technology mainly utilizes the thermal melting properties of thermoplastic materials (such as PLA, ABS, PA, PC, and PE, etc.), and flows the molten material through the nozzle assembly through the nozzle and forms it layer by layer on the printing platform. Based on the principle of fuse accumulation, although rapid prototyping can be achieved, the degree of bonding between fuses is far lower than that of the pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C64/118B29C64/245B33Y10/00B33Y30/00
CPCB29C64/118B29C64/245B33Y10/00B33Y30/00
Inventor 丁庆军吴奕宏褚效成赵盖
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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