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Porous silicon carbide preform with controllable porosity and preparation method thereof

A porous silicon carbide and preform technology, applied in ceramic products, household appliances, other household appliances, etc., can solve the problems of closed pores, difficult to meet electronic packaging, unfavorable heat dissipation requirements of materials, etc., and achieve porosity and pore size quality assurance Effect

Inactive Publication Date: 2022-05-13
苏州思萃热控材料科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the silicon carbide preforms prepared by the existing technology have the defects of uncontrollable porosity and closed pores inside, which are difficult to meet the heat dissipation requirements of electronic packaging materials and are not conducive to the preparation of high-quality composite materials.

Method used

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  • Porous silicon carbide preform with controllable porosity and preparation method thereof

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Embodiment Construction

[0033] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0034] Wherein, the accompanying drawings are only for illustrative purposes, showing only schematic diagrams, rather than physical drawings, and should not be construed as limitations on this patent; in order to better illustrate the embodiments of the present invention, some parts of the accompanying drawings will be omitted, Enlarged or reduced, does not represent actual product size.

[0035] refer to figure 1 A porous silicon carbide preform with controllable porosity is shown, the porous silicon carbide preform is formed by mixing silicon carbide powders of three different particle sizes, and in terms of mass percentage: including 50 %-60% of silicon carbide coarse powder with a particle size of 100-120 μm, 30%-40% of silicon carbide fine powder with a particle size of 30-40 μm, and 10%-15% o...

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Abstract

The invention belongs to the field of composite material preparation, and particularly relates to a porous silicon carbide preform with controllable porosity and a preparation method thereof.The porous silicon carbide preform is formed by mixing and compounding three kinds of silicon carbide powder with different particle sizes, the silicon carbide powder is prepared from, by mass, 50%-60% of silicon carbide coarse powder with the particle size being 100-120 microns, 30%-40% of silicon carbide fine powder with the particle size being 30-40 microns and 10%-15% of silicon carbide micro powder with the particle size being 6-8 microns, and mixing, primary ball milling, drying, secondary mixed ball milling, degassing, molding, heating elimination, sintering molding, detection and permeation filling are conducted. And finally, the aluminum silicon carbide composite material is obtained, so that the quality of the manufactured aluminum silicon carbide composite material is ensured, and the porosity and aperture quality of the produced aluminum silicon carbide composite material are ensured.

Description

technical field [0001] The invention belongs to the field of composite material preparation, and in particular relates to a porous silicon carbide prefabricated body with controllable porosity and a preparation method thereof. Background technique [0002] When a high-power IGBT (insulated gate bipolar transistor) module is working, it will generate a lot of heat, especially the IGBT module with a working current of more than 600A. With the continuous development of semiconductor technology, the integration of high-power module chips and chip power is also increasing, and the operating temperature of IGBT is also rising. The corresponding requirements for packaging materials, especially heat dissipation substrates, are also increasing. The substrate has a low coefficient of linear expansion that matches the electronic chip, and it is required to meet the requirements of light weight. At the same time, it is required that the density of the material should be as low as possib...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B38/06C04B35/565C04B35/622C04B35/64C04B41/88
CPCC04B38/067C04B35/565C04B35/622C04B35/64C04B41/88C04B41/5155C04B41/009C04B2235/6562C04B2235/6567C04B41/4523C04B41/0072
Inventor 李新中刘仕超雷定中王帆朱明
Owner 苏州思萃热控材料科技有限公司