Numerical calculation method for pressure drop and shunting uniformity of printed circuit board heat exchanger

A printed circuit board, numerical calculation technology, applied in the direction of calculation, complex mathematical operation, electrical digital data processing, etc., can solve the problem of inability to consider flow channel splitting and uniformity, no mature calculation model, heat exchanger performance calculation error and other problems, to achieve the effect of shortening the time of analysis and design, strong operability of calculation process, and avoiding principle errors.

Active Publication Date: 2022-05-13
XI AN JIAOTONG UNIV
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no effective calculation method for the pressure drop and split flow uniformity of this type of heat exchanger. There is no mature calculation model for the pressure drop calculation, and it is difficult to perform a complete limited calculation due to the huge number of heat exchanger core channels. Therefore, the overall pressure drop is usually estimated by referring to the empirical formula of flow resistance or the equivalent computational fluid dynamics model of the porous media model. The calculation of the heat transfer performance of the heat exchanger brings errors, which affects the overall safety of the heat exchanger, and the equivalent computational fluid dynamics model of the porous media model consumes a large amount of computing resources, lacking in economy and efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Numerical calculation method for pressure drop and shunting uniformity of printed circuit board heat exchanger
  • Numerical calculation method for pressure drop and shunting uniformity of printed circuit board heat exchanger
  • Numerical calculation method for pressure drop and shunting uniformity of printed circuit board heat exchanger

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0048] Such as figure 1 As shown, the present invention is a numerical calculation method for the pressure drop and shunt flow uniformity of a printed circuit board heat exchanger. According to the structure of the heat exchanger, a multi-level model of flow resistance is established, and the multi-level pressure drop of each pipeline is calculate...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a numerical calculation method for pressure drop and shunting uniformity of a printed circuit board heat exchanger, a calculation object structure of the method comprises a heat exchanger core body and a cold and hot side interface cavity body, and the core body adopts a primary side plate and a secondary side plate which are alternately arranged; according to the method, a heat exchanger flow resistance multi-stage model is established based on a core body structure and flow channel sizes, pressure drop of each stage is established in combination with on-way resistance and local resistance formulas to calculate speed distribution in each flow channel of a core body, and finally the overall pressure drop of a working medium passing through the core body of the heat exchanger and relative flow uniformity in each flow channel are obtained. The invention provides a complete and effective numerical calculation method for the pressure drop and shunting uniformity of the printed circuit board heat exchanger, a direct calculation method and a numerical result are provided for the most concerned pressure drop and shunting uniformity of the heat exchanger core, the design cost is greatly reduced, and the design efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board heat exchangers, in particular to a numerical calculation method for pressure drop and split flow uniformity of a printed circuit board heat exchanger. Background technique [0002] The printed circuit board heat exchanger is a high-efficiency and compact heat exchanger. The core of the heat exchanger is composed of superimposed heat exchange plates arranged with dense and small-sized flow channels. The primary side heat exchange plate and the secondary side heat exchange plate Arranged alternately to form independent heat exchange areas. This structure makes the heat exchanger have the advantages of high heat exchange efficiency, high temperature resistance, high pressure resistance, etc., and is widely used in deep sea floating liquefaction, nuclear power, thermal power and other fields. [0003] In this context, in recent years, the design and analysis methods for printed circuit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/28G06F17/11G06F113/08G06F113/14G06F119/08G06F119/14
CPCG06F30/28G06F17/11G06F2119/08G06F2119/14G06F2113/08G06F2113/14
Inventor 李昕泽张大林苏光辉李新宇
Owner XI AN JIAOTONG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products