Power module and manufacturing method thereof
A technology of power modules, mechanical methods, applied in the direction of semiconductor/solid-state device manufacturing, coupling devices, contact parts, etc., which can solve the problems of adverse effects on reliability, inefficient production methods, and inability to keep all materials in place
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[0022] exist figure 1 A typical power module of 62 mm width according to the prior art is shown in a perspective view in . The power module has a base plate 10 , a housing 19 on top of the base plate 10 and electrical connections 17 on top of it, as well as signal terminals 18 . The dimensions of the module backplane shown are approximately 62mm 2 x 106mm 2 .
[0023] exist figure 2 A typical power module stack according to the prior art is shown in a general cross-sectional view in . The power module stack comprises: a base plate 10; an attached or integrated substrate 12 on a solder or frit layer 11 with an attached chip 14 placed on top of the substrate 12 layer on a solder / frit layer 13 / 15 (eg, IGBT, diode, MOSFET, etc.); wire bonds 16 for electrical connections; power terminals 17; and similar but not shown signal terminals for external bus bar attachment and external control. Power terminals 17 for high current and signal pins are soldered, welded or connected t...
PUM
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