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Power module and manufacturing method thereof

A technology of power modules, mechanical methods, applied in the direction of semiconductor/solid-state device manufacturing, coupling devices, contact parts, etc., which can solve the problems of adverse effects on reliability, inefficient production methods, and inability to keep all materials in place

Pending Publication Date: 2022-05-13
SWISSSEM TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

They always have some potential to re-melt previously created layers of solder, which can adversely affect reliability
Fixtures are complicated and don't hold all the material in place
Some terminals may mechanically shield the substrate and limit accessibility
All in all, the production method described is rather inefficient

Method used

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  • Power module and manufacturing method thereof
  • Power module and manufacturing method thereof
  • Power module and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] exist figure 1 A typical power module of 62 mm width according to the prior art is shown in a perspective view in . The power module has a base plate 10 , a housing 19 on top of the base plate 10 and electrical connections 17 on top of it, as well as signal terminals 18 . The dimensions of the module backplane shown are approximately 62mm 2 x 106mm 2 .

[0023] exist figure 2 A typical power module stack according to the prior art is shown in a general cross-sectional view in . The power module stack comprises: a base plate 10; an attached or integrated substrate 12 on a solder or frit layer 11 with an attached chip 14 placed on top of the substrate 12 layer on a solder / frit layer 13 / 15 (eg, IGBT, diode, MOSFET, etc.); wire bonds 16 for electrical connections; power terminals 17; and similar but not shown signal terminals for external bus bar attachment and external control. Power terminals 17 for high current and signal pins are soldered, welded or connected t...

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PUM

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Abstract

The invention discloses a power module and a manufacturing method thereof. The power module comprises press-fit pins (34) insertable into bushings (32) on the substrate (12) for electrical and mechanical connection of the terminals. The substrate (12) rests on the base plate (10). A potential alignment frame (33) ensures the accuracy of all elements. The electrical and mechanical connections of the power and signal terminals are achieved by a plurality of (high current) or a single press-fit connection. When the pins (34) are inserted, they fit closely in these bushings (32) against frictional forces, and after establishing the fit, for each individual pin fit, an electrical contact over the surface is established.

Description

Background technique [0001] In industrial applications or electric vehicles, power modules in the kilowatt class or more are used in millions of units per year. They are used to handle the electrical current and ensure the mechanical support of the connection. Such modules are built into inverters for electric vehicles, drives for industrial applications such as elevators, fan controllers, etc. The efficient production of these modules is as high as the thermal and electrical characteristics and reliability levels required by customers. The key is the electrical connection of the signal and power terminals to the inner conductive layers. Currently, about 10 million of these power modules are manufactured each year, and the manufacturing process remains a challenging task. The expected product useful life is approximately 10 to 15 years. [0002] A typical power module consists of a convexly curved base plate on which is attached an integrated substrate with an insulating l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/18H01L23/48H01L21/50H01L21/60
CPCH01L25/18H01L23/48H01L21/50H01L24/90H01L2224/90H01L23/053H01L25/072H01L23/04H01L25/50H01L2224/48139H01L2224/48227H01L2224/73265H01L2224/4846H01L2224/48472H01L2224/32225H01L2924/19107H01L2924/00H01R13/629H01L23/3107H01L24/48H01L24/49
Inventor 斯文·马蒂亚斯拉斐尔·M·施内尔尚塔尔·I·T·托克尔
Owner SWISSSEM TECH AG