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Upper cover and semiconductor packaging device

A column and carrier technology, applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of high manufacturing costs and unfavorable market competitiveness, and achieve the effect of simplifying the manufacturing process and reducing manufacturing costs

Pending Publication Date: 2022-05-17
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Currently, most of the upper cover designs used to avoid electromagnetic interference are achieved by using CNC (Computerized Numerical Control Machine) lathes for metal processing or multiple punch forming processes. The manufacturing cost is relatively high and not Conducive to the market competitiveness of products

Method used

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  • Upper cover and semiconductor packaging device
  • Upper cover and semiconductor packaging device
  • Upper cover and semiconductor packaging device

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Embodiment Construction

[0045] The specific implementation manners of the present disclosure will be described below in conjunction with the accompanying drawings and examples. Those skilled in the art can easily understand the technical problems solved by the present disclosure and the technical effects produced through the contents recorded in this specification. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. In addition, for the convenience of description, only the parts related to the related invention are shown in the drawings.

[0046] It should be noted that the structures, proportions, sizes, etc. shown in the accompanying drawings of the specification are only used to match the content recorded in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present disclosure. There are limited conditions, so it has...

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Abstract

The invention relates to an upper cover and a semiconductor packaging device. According to the design, an upper cover comprises a vertical part, the vertical part is an annular cylinder and is provided with a containing space in a surrounding mode, one end of the vertical part is provided with a first extending part, and one end of the first extending part extends out of the containing space; the first extending part is matched with the outer wall of the vertical part, the waterproof rubber lantern ring can be arranged, the first extending part can be formed through folding, and the structure of the upper cover is simplified.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductor packaging, in particular to an upper cover and a semiconductor packaging device. Background technique [0002] The current industry is increasingly demanding waterproof performance of MEMS (Micro-Electro-Mechanical System, micro-electro-mechanical system) components, especially for portable consumer electronic products. [0003] In order to cooperate with the setting of the waterproof rubber O-ring (Rubber O-ring) and prevent it from falling off, the upper cover (lid) used in MEMS components must have a brim-shaped design, and electromagnetic shielding requirements must also be considered, so Usually a metal cover is used to avoid electromagnetic interference. [0004] Currently, most of the upper cover designs used to avoid electromagnetic interference are achieved by using CNC (Computerized Numerical Control Machine) lathes for metal processing or multiple punch forming processes...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/04H01L23/06H01L23/10H01L23/552
CPCH01L23/04H01L23/06H01L23/10H01L23/552
Inventor 黄煜哲
Owner ADVANCED SEMICON ENG INC