Unlock instant, AI-driven research and patent intelligence for your innovation.

Mini/micro chip flexible flying chip-pricking device

A thorn crystal and chip technology, applied in the field of Mini/MicroLED chip transfer packaging, can solve the problems of increasing the loss of the motion platform, unavoidable frequent start and stop, reducing the packaging accuracy, etc., achieving good thorn crystal transfer efficiency, improving the thorn crystal process, Good transfer accuracy

Active Publication Date: 2022-05-17
GUANGDONG UNIV OF TECH
View PDF9 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such a process greatly restricts the transfer speed, and the motion platform will inevitably start and stop frequently, which will increase the loss of the motion platform, and the jitter derived from the start and stop will greatly reduce the accuracy of the package.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mini/micro chip flexible flying chip-pricking device
  • Mini/micro chip flexible flying chip-pricking device
  • Mini/micro chip flexible flying chip-pricking device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0033] An example of this application, such as Figure 1 to Figure 4As shown, a Mini / micro chip flexible flying spine device includes: a gantry 210, a first motion platform 220, a workbench 230, a second motion platform 240, an industrial camera 250 and a spine unit 100; the first The operating platform is used to carry the circuit substrate 260; the workbench 230 is used to heat and fix the welding of the LED chip 300 and the circuit substrate 260; the second motion platform 240 is used to carry the LED chip 300, and the Move directly above the motion platform 220; the industrial camera 250 is used to detect the relative position of the circuit substrate 260 and each LED chip 300; the spine unit 100 is used to transfer the LED chips 300 on the second motion platform 240 to the The circuit substrat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
sizeaaaaaaaaaa
sizeaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to the technical field of transfer packaging of Mini / Micro LED (Light Emitting Diode) chips, in particular to a flexible flying chip pricking device for a Mini / Micro chip. The flexible flying crystal pricking device comprises a first driving frame, a second driving frame, a mounting seat, a first crystal pricking driving device, a second crystal pricking driving device, a first flexible hinge, a second flexible hinge and a pricking needle, the second driving frame is connected with the first frame through the first flexible hinge; the mounting seat is connected with the left side and the right side of the second driving frame through second flexible hinges; compared with a laser transfer technology, the flexible flying crystal thorn device is lower in cost, and the precision is better guaranteed; compared with a vacuum suction nozzle transfer technology, the transfer efficiency is higher, and the transfer quality is better; compared with a traditional wafer pricking device, the wafer pricking device has the advantages that the wafer pricking process is improved by realizing relative rest of the needle head, the chip and the substrate, so that the wafer pricking transfer efficiency is better, and the transfer precision is better.

Description

technical field [0001] The invention relates to the technical field of Mini / Micro LED chip transfer packaging, in particular to a Mini / micro chip flexible flying spine device. Background technique [0002] With the continuous development of chip manufacturing technology, LED chips are becoming thinner, miniaturized, and arrayed. At present, high-end LED chips have fully entered the era of microns. The size of Mini LED chips is between 100 and 300 microns, while the minimum size of Micro LED chips has been reduced to less than 50 μm, and the minimum wafer pitch has been reduced to 5-10 μm. How to realize the scale-up of chips from the wafer to the display panel has become a key technical problem in this field. [0003] The miniaturization of the chip size and the scale of the number of chips put forward strict requirements on the accuracy and efficiency of the transfer packaging. The accuracy and efficiency directly affect the yield of the transfer packaging. At the micron ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L21/67
CPCH01L33/0093H01L33/0095H01L21/67144H01L21/6838
Inventor 陈新李宏城汤晖林志杭高健刘强陈桪
Owner GUANGDONG UNIV OF TECH