Pyroelectric infrared sensor and packaging method thereof

A technology of pyroelectric infrared and packaging method, which is applied in the field of infrared sensors and can solve the problems of complex manufacturing process of pyroelectric infrared sensors and the like

Pending Publication Date: 2022-05-20
深圳市华三探感科技有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to overcome the problem of complex manufacturing process of the pyroelectric infrared sensor caused by custom-made supporting parts or

Method used

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  • Pyroelectric infrared sensor and packaging method thereof
  • Pyroelectric infrared sensor and packaging method thereof
  • Pyroelectric infrared sensor and packaging method thereof

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Embodiment Construction

[0042] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0043] In describing the present invention, it is to be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", The orientation or positional relationship indicated by "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" etc. is based on the orientation or positional relationship shown in the drawings, It is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the device or element referred to must have a specif...

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Abstract

The invention belongs to the technical field of infrared sensors, and particularly relates to a pyroelectric infrared sensor and a packaging method thereof. The packaging method of the pyroelectric infrared sensor comprises the following steps: S1, preparing a semi-finished product of a pipe cap: arranging a window on the pipe cap, and embedding an infrared optical filter on the window; s2, preparing a semi-finished product of the substrate: forming a solder paste integrally-formed supporting piece bonding pad on the substrate, and coating the solder paste on the solder paste integrally-formed supporting piece bonding pad; enabling the substrate coated with the solder paste to pass through a reflow soldering furnace to melt tin and solidify, and forming the solder paste integrally-formed supporting piece on the solder paste integrally-formed supporting piece bonding pad; s3, an infrared sensitive element is installed, wherein the infrared sensitive element is installed on the solder paste integrally-formed supporting piece; and S4, mounting a pipe cap: mounting the pipe cap on the upper surface of the substrate. According to the solder paste integrally-formed supporting piece, the number of used raw materials and parts is small, and the working procedure is simple.

Description

technical field [0001] The invention belongs to the technical field of infrared sensors, in particular to a pyroelectric infrared sensor and a packaging method thereof. Background technique [0002] Pyroelectric infrared sensor is a sensor for detecting infrared thermal radiation made of a material with good pyroelectricity as the core. It is mainly used to detect infrared rays of people and animals or other objects with thermal radiation to judge Whether there are people or other animals in the space. Widely used in induction lighting, intrusion alarm, security, smart home and other fields. [0003] In the prior art, the packaging types of pyroelectric infrared sensors are mainly in-line type, and also have patch type. The in-line pyroelectric infrared sensor mainly has a tube cap, and the tube seat forms a closed space. The window on the surface of the tube cap is equipped with an infrared optical filter. There is a pyroelectric infrared sensor in the closed space, and t...

Claims

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Application Information

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IPC IPC(8): G01J5/00G01J5/02G01J5/12G01V8/10
CPCG01J5/0205G01J5/0025G01J5/022G01J5/0275G01J5/12G01V8/10Y02P70/50
Inventor 吴华民刘财伟
Owner 深圳市华三探感科技有限公司
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