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Semiconductor memory device and method of manufacturing semiconductor memory device

A memory and semiconductor technology, applied in the field of semiconductor memory devices and semiconductor memory device manufacturing, capable of solving problems such as operational reliability degradation and structural defects of semiconductor memory devices

Pending Publication Date: 2022-05-20
SK HYNIX INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

When the process is performed continuously, the heat generated in the subsequent process may cause defects in the already formed structure
Therefore, the operational reliability of the semiconductor memory device may deteriorate

Method used

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  • Semiconductor memory device and method of manufacturing semiconductor memory device
  • Semiconductor memory device and method of manufacturing semiconductor memory device
  • Semiconductor memory device and method of manufacturing semiconductor memory device

Examples

Experimental program
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Embodiment Construction

[0020] In order to describe embodiments according to the concepts of the present disclosure, specific structural or functional descriptions disclosed herein are merely exemplary. Embodiments according to the concepts of the present disclosure may be embodied in various forms and should not be construed as limited to the specific embodiments set forth herein.

[0021] Hereinafter, the terms 'first', 'second', etc. are used to distinguish one component from another and are not intended to imply a specific number or order of the components. These terms can be used to describe various components, but the components are not limited by these terms.

[0022] Embodiments may provide a semiconductor memory device and a method of manufacturing the semiconductor memory device that may improve operational reliability.

[0023] figure 1 is a block diagram illustrating a semiconductor memory device according to an embodiment of the present disclosure.

[0024] refer to figure 1 , the se...

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PUM

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Abstract

The invention provides a semiconductor memory device and a manufacturing method of the semiconductor memory device. The semiconductor memory device includes: a first circuit structure; a first conductive line connected to the first circuit structure; a second conductive line facing the first conductive line; and a second circuit structure that overlaps the first circuit structure and between which the first conductive line and the second conductive line are interposed, the second circuit structure being connected to the second conductive line. One of the first conductive line and the second conductive line has a region protruding toward the other of the first conductive line and the second conductive line.

Description

technical field [0001] The present disclosure may generally relate to a semiconductor memory device and a method of manufacturing the semiconductor memory device, and more particularly, to a semiconductor memory device including a bonding structure and a method of manufacturing the semiconductor memory device. Background technique [0002] A semiconductor memory device may include a memory cell array including a plurality of memory cells and peripheral circuits for controlling operations of the memory cell array. [0003] The peripheral circuits and the memory cell array may be provided using sequentially performed processes. When the processes are continuously performed, heat generated in subsequent processes may cause defects in structures that have been formed. Therefore, the operational reliability of the semiconductor memory device may deteriorate. Contents of the invention [0004] According to an embodiment of the present disclosure, there may be provided a semico...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/11582H01L27/11573H01L27/11575H01L27/1157H01L27/11556H01L27/11529H01L27/11548H01L27/11524
CPCH10B41/41H10B41/50H10B41/35H10B43/50H10B43/40H10B41/27H10B43/35H10B43/27H01L2224/08145H01L24/80H01L2225/06524H01L2225/06541H01L25/0657H01L2224/02331H01L2224/02351H01L2224/0235H01L24/08H01L24/05H01L2224/80895H01L2224/80896H01L2224/05548H01L2224/05547H01L2224/80357H01L2224/08058H01L2224/05556H01L2924/00014H01L21/76877H01L21/7685H10B41/40H10B41/10H10B43/10
Inventor 李南宰
Owner SK HYNIX INC
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