A microphone assembly and electronic equipment
A microphone and component technology, which is applied in the field of microphones, can solve the problems of increasing the size of MEMS microphones and not being able to adapt to the thinning of electronic products, and achieve the effects of preventing the failure of the second capacitor structure, preventing the second electrode from shaking, and improving reliability
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Embodiment 1
[0043] Figure 1A is a three-dimensional schematic diagram of a microphone assembly provided according to an embodiment of the present invention, Figure 1B Yes Figure 1A Partial cross-sectional structural schematic diagram of the microphone assembly in ; Figure 1C Yes Figure 1A Partial top-view structural schematic diagram of the diaphragm in ; Figure 1D Yes Figure 1A Partial top-view structural schematic diagram of the substrate in; Figure 1E Yes Figure 1A Partial top-view structural schematic diagram of the back plate in .
[0044] see Figures 1A-1E As shown, an embodiment of the present invention provides a microphone assembly 1000 including a substrate 100, a diaphragm 200, and a back plate 300. In a direction perpendicular to the plane where the substrate 100 is located, the diaphragm 200 is located on the substrate 100 and the back plate 300; the diaphragm 200 has an acoustic wave conduction area 211, and the acoustic wave conduction area 211 is provided with a...
Embodiment 2
[0069] image 3 It is a three-dimensional schematic diagram of a microphone assembly provided according to another embodiment of the present invention.
[0070] like image 3 shown, by way of example, image 3 and Figure 1A The difference is: Figure 1A The back plate 300 has at least one second hollow area 330 , and the at least one second hollow area 330 surrounds the second electrode 310 to reduce the distance between the back plate 300 and the diaphragm 200 . Laminate damping. while in image 3 The back plate 300 in the middle of the present invention includes at least one back plate through hole 340, and the at least one back plate through hole 340 surrounds the second electrode 310 to reduce the distance between the back plate 300 and the diaphragm 200. between the lamination damping. image 3 The function of the back plate through hole 340 in the FIG. In addition, the back plate through hole 340 can also be used as a release hole for removing the insulating film ...
Embodiment 3
[0072] Figure 4 to Figure 6 It is a three-dimensional schematic diagram of a microphone assembly provided according to another embodiment of the present invention.
[0073] like Figure 4 shown, by way of example, Figure 4 and image 3 The difference is that: the edge of the acoustic wave conducting region 211 is provided with a first baffle structure 201 facing the second electrode 310 , and there is a gap between the first baffle structure 201 and the second electrode 310 . Specifically, in the embodiment of the present invention, the first baffle structure 201 may form a continuous or discontinuous ring shape at the edge of the acoustic wave conduction region 211 , and the first baffle structure 201 is made of insulating material. It has a limiting function to prevent the diaphragm 200 from adhering to the back plate 300 in a humid environment, and also has a dust-proof effect, which can block at least one back plate through hole 340 passing through the back plate 300 ...
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