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Microphone assembly and electronic equipment

A technology for microphones and components, applied in the field of microphones, can solve the problems of large size of MEMS microphones and inability to meet the thin and light design of electronic products, and achieve the effects of improving sensitivity and accuracy, reducing volume and reducing surface vibration

Active Publication Date: 2022-05-17
MEMSENSING MICROSYST SUZHOU CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This embodiment provides a microphone assembly and electronic equipment to effectively solve the problem that the size of the existing MEMS microphone is too large, so that it cannot meet the problem of light and thin design of electronic products

Method used

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  • Microphone assembly and electronic equipment
  • Microphone assembly and electronic equipment
  • Microphone assembly and electronic equipment

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Embodiment Construction

[0074] The technical solution in this embodiment will be clearly and completely described below in conjunction with the accompanying drawings in this embodiment. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0075] In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communicat...

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Abstract

The invention discloses a microphone assembly and electronic equipment. The microphone assembly comprises a substrate and a vibrating diaphragm. A partial area of the substrate forms a first electrode, the vibrating diaphragm is provided with a sound wave sensitive area, and the sound wave sensitive area forms a second electrode; the projections of the first electrode and the second electrode on a plane perpendicular to the thickness direction of the substrate are overlapped. According to the technical scheme disclosed by the invention, the first electrode is formed by the partial region of the substrate, and the first electrode does not need to be additionally arranged between the substrate and the vibrating diaphragm to form a capacitor structure, so that the size of the microphone assembly can be reduced, and the problem that the size of an existing MEMS microphone is too large, and the light and thin design of an electronic product cannot be met is effectively solved.

Description

technical field [0001] The present application relates to the technical field of microphones, in particular to a microphone assembly and electronic equipment. Background technique [0002] A microphone is a pressure sensor that converts sound pressure signals into electrical signals. Small microphones manufactured using micro-electro-mechanical technology are called MEMS (Micro-Electro-Mechanical System) microphones or micro-microphones. A MEMS microphone chip generally includes a substrate, a diaphragm, and a back plate. The diaphragm and the back plate are important components in the MEMS microphone chip. The diaphragm and the back plate are arranged in parallel and at intervals. The two constitute the two electrode plates of the flat capacitor. The diaphragm is used to vibrate under the action of sound waves. As a result, the relative distance between the back plate and the diaphragm changes, so that the capacitance value of the plate capacitor changes, and the change in...

Claims

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Application Information

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IPC IPC(8): H04R19/04H04R19/00H04R7/18
CPCH04R19/04H04R19/005H04R7/18H04R2201/003H04R2499/11
Inventor 荣根兰刘青
Owner MEMSENSING MICROSYST SUZHOU CHINA
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