A kind of microphone assembly and electronic equipment
A technology for microphones and components, applied in the field of microphones, can solve the problems of increasing the size of MEMS microphones, unable to adapt to the thinning of electronic products, etc., and achieve the effects of preventing the failure of the second capacitor structure, preventing the second electrode from shaking, and improving performance.
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Embodiment 1
[0046] Figure 1A is a three-dimensional schematic diagram of a microphone assembly provided according to an embodiment of the present invention, Figure 1B Yes Figure 1A Partial cross-sectional structural schematic diagram of the microphone assembly in ; Figure 1C Yes Figure 1A Partial top-view structural schematic diagram of the diaphragm in ; Figure 1D Yes Figure 1A Partial top-view structure schematic diagram of the back plate in ; Figure 1E Yes Figure 1A Partial top-view structural schematic of the substrate in .
[0047] see Figures 1A-1E As shown, an embodiment of the present invention provides a microphone assembly 1000 including a substrate 100, a diaphragm 200, and a back plate 300. In a direction perpendicular to the plane where the substrate 100 is located, the diaphragm 200 is located on the substrate 100 and the back plate 300; the diaphragm 200 has an acoustic wave conduction area 211, and the acoustic wave conduction area 211 is provided with at leas...
Embodiment 2
[0073] Figure 3A is a three-dimensional schematic diagram of a microphone assembly provided according to another embodiment of the present invention, Figure 3B Yes Figure 3A Partial top-view structure diagram of the back plate in Figure 3C Yes Figure 3A Partial top-view structural schematic of the substrate in .
[0074] see Figures 3A-3C As shown, the first electrode 110 has at least two of the first hollow regions 118 and / or the second electrode 310 has at least two of the second hollow regions 318, and is perpendicular to where the substrate 100 is located. In the direction of the plane, the projections of the regions formed by all the first hollow regions 118 and the regions formed by all the second hollow regions 318 at least partially overlap.
[0075] Illustratively, by Figures 3A-3C It can be seen from the above that the second electrode 310 has more than two second hollow regions 318. Similarly, the first electrode 110 can also have more than two first ho...
Embodiment 3
[0077] Figure 4 It is a three-dimensional schematic diagram of a microphone assembly provided according to another embodiment of the present invention.
[0078] like Figure 4 shown, by way of example, Figure 4 The microphone assembly in the Figure 1A The difference is: Figure 1A The back plate 300 has at least one third hollow area 330 , and the at least one third hollow area 330 surrounds the second electrode 310 to reduce the distance between the back plate 300 and the diaphragm 200 . Laminate damping. while in Figure 4 The back plate 300 in the middle of the present invention includes at least one back plate through hole 340, and the at least one back plate through hole 340 surrounds the second electrode 310 to reduce the distance between the back plate 300 and the diaphragm 200. between the lamination damping. Figure 4 The function of the back plate through hole 340 in the FIG. However, the manner in which the back plate through holes 340 are provided is compa...
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