Microphone assembly and electronic equipment
A microphone and component technology, applied in the field of microphones, can solve the problems of not being able to adapt to the thinning of electronic products, increase the size of MEMS microphones, etc., and achieve the effect of preventing the failure of the second capacitor structure, preventing the second electrode from shaking, and improving reliability
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Embodiment 1
[0043] Figure 1A is a schematic perspective view of a microphone assembly provided according to an embodiment of the present invention, Figure 1B yes Figure 1A Partial cross-sectional structural schematic diagram of the microphone assembly in ; Figure 1C yes Figure 1A Partial top view structural diagram of the diaphragm in ; Figure 1D yes Figure 1A Partial top view structural schematic diagram of the base in ; Figure 1E yes Figure 1A Schematic diagram of the partial top view structure of the back plate in .
[0044] see Figure 1A-Figure 1E As shown, the embodiment of the present invention provides a microphone assembly 1000 including a base 100, a diaphragm 200, and a back plate 300. In a direction perpendicular to the plane where the base 100 is located, the diaphragm 200 is located on the base 100 and the back plate 300; the diaphragm 200 has a sound wave conduction region 211, and at least one sound hole 212 is provided on the sound wave conduction region 211 thr...
Embodiment 2
[0069] image 3 It is a three-dimensional schematic diagram of a microphone assembly provided according to another embodiment of the present invention.
[0070] Such as image 3 As shown, illustratively, image 3 and Figure 1A The difference is: Figure 1A The back plate 300 has at least one second hollow area 330, and the at least one second hollow area 330 surrounds the second electrode 310 to reduce the distance between the back plate 300 and the diaphragm 200. Film damping. while in image 3 The back plate 300 includes at least one back plate through hole 340, and the at least one back plate through hole 340 surrounds the second electrode 310 to reduce the distance between the back plate 300 and the diaphragm 200. film damping between them. image 3 The function of the through hole 340 in the back plate is similar to that of the second hollow area 330 , and will not be repeated here. In addition, the back plate through hole 340 can also be used as a release hole for...
Embodiment 3
[0072] Figure 4 to Figure 6 It is a three-dimensional schematic diagram of a microphone assembly provided according to another embodiment of the present invention.
[0073] Such as Figure 4 As shown, illustratively, Figure 4 and image 3 The difference is that: the edge of the acoustic wave conducting region 211 is provided with a first baffle structure 201 facing the second electrode 310 , and there is a gap between the first baffle structure 201 and the second electrode 310 . Specifically, in the embodiment of the present invention, the first baffle structure 201 may form a continuous or discontinuous ring at the edge of the sound wave conducting area 211, and the first baffle structure 201 is made of an insulating material. It has a position limiting function, which can prevent the diaphragm 200 from sticking to the back plate 300 in a humid environment, and also has a dustproof effect, which can block at least one back plate through hole 340 passing through the back ...
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