Printed board with buried resistor and preparation method thereof
A printed board and resistor technology, which is applied in chemical/electrolytic methods to remove conductive materials, contain printed resistors, and contain printed electrical components, etc., can solve problems such as low production efficiency and achieve the effect of improving production efficiency.
Pending Publication Date: 2022-05-20
GUANGZHOU FANGBANG ELECTRONICS
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Problems solved by technology
[0003] In the existing method of preparing printed boards with buried resistors, the finished resistive copper foil is generally pressed together with the printed board, and then the resistive copper foil is etched to make buried resistive patterns and conductive terminals. However, If the resistance copper foil is unqualified in the production of buried resistance patterns and conductive terminals, it is necessary to repeat the operations such as pressing and etching, resulting in low production efficiency
Method used
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[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0038] see figure 1 As shown, it is a flowchart of a method for manufacturing a printed board with buried resistors in an embodiment of the present invention.
[0039] The preparation method of the printed circuit board with buried resistance in the embodiment of the present invention comprises:
[0040] Step S101, providing a buried resistance metal foil; the buried resistance metal foil includes a conductive layer 1, a resistance layer 2 and a dielectric layer 5...
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The invention relates to the technical field of printed boards, and discloses a printed board with a buried resistor and a preparation method thereof.The method comprises the steps that firstly, a buried resistor metal foil is provided, the buried resistor metal foil comprises a conductive layer, a dielectric layer and a resistor layer arranged between the conductive layer and the dielectric layer, the conductive layer and the resistor layer are manufactured to form a resistor circuit, and then the resistor circuit is formed; according to the embodiment of the invention, the manufacturing of the resistor circuit is firstly completed, then the qualified buried resistor metal foil and the printed board are laminated, so that the printed board with the buried resistor is obtained, the manufacturing of the resistor circuit is completed, and then the printed board with the buried resistor is obtained. The problem that in the prior art, when etching is unqualified after the resistor metal foil is pressed, pressing and other operation processes need to be carried out again, and consequently efficiency is low is solved, and therefore the preparation efficiency is effectively improved.
Description
technical field [0001] The invention relates to the technical field of printed boards, in particular to a printed board with buried resistors and a preparation method thereof. Background technique [0002] At present, with the development trend of miniaturization of electronic products, higher requirements are placed on the packaging density and volume of electronic products, and burying passive components such as resistors in printed boards is a way to reduce the size of electronic products. effective means. [0003] In the existing method of preparing printed boards with buried resistors, the finished resistive copper foil is generally pressed together with the printed board, and then the resistive copper foil is etched to make buried resistive patterns and conductive terminals. However, If the resistance copper foil is unqualified in the production of buried resistance patterns and conductive terminals, it is necessary to repeat the operations such as pressing and etchin...
Claims
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Login to View More IPC IPC(8): H05K3/06H05K1/16
CPCH05K3/06H05K1/167
Inventor 苏陟高强
Owner GUANGZHOU FANGBANG ELECTRONICS