Anti-crack gypsum board
The technology of gypsum board and board body is applied in the field of building decoration materials, which can solve the problems of poor waterproof performance of gypsum board and low structural strength of gypsum board, and achieve the effects of improving waterproof effect, enhancing bonding force and improving waterproof performance.
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[0042] As an embodiment of the present invention, the reinforcing layer 11 is made of thermosetting resin, and the thermosetting resin is preferably 5224 high temperature curing epoxy resin;
[0043] During operation, the reinforcing layer 11 is made of a thermosetting resin material. The thermosetting resin is preferably 5224 high temperature curing epoxy resin. The curing reaction of 5224 high temperature curing epoxy resin is 180 degrees Celsius, which is greater than the peak value of the gypsum board during the drying stage. The temperature is 160 degrees Celsius. After the gypsum board is dried and cured, the temperature is heated again to melt the 5224 high temperature curing epoxy resin. The melted 5224 high temperature curing epoxy resin is melted and cured in a temperature space between 180 degrees Celsius and 190 degrees Celsius. During this process, the melted 5224 high temperature curing epoxy resin will penetrate into the surface layer of the board body 1 and then...
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