Vacuum pumping valve and vacuum control system of semiconductor equipment

Abstract

The invention discloses a vacuum pumping valve and a vacuum control system of semiconductor equipment, the vacuum pumping valve comprises a driving device, a base, a turntable and a group of blades, the blades are arranged between the base and the turntable, the driving device drives the turntable to rotate, the rotating turntable drives the blades to synchronously move on the base, and the rotating turntable drives the blades to synchronously move on the base. The blades move synchronously, the blades moving synchronously jointly form an extraction opening, the extraction opening is in a regular polygon shape and takes the circle center of the rotating disc as the center, the number of the blades is the same as the number of the edges of the extraction opening, and the opening degree of the extraction opening is adjusted through synchronous movement of the blades. The rotating turntable is used for controlling the movement of the blades to adjust the size of the extraction opening of the valve, so that the effective passing area of airflow and the vacuum pressure of the reaction cavity are controlled, meanwhile, the problem of asymmetric plasma distribution caused by eccentricity of the extraction direction can be effectively solved, the airflow circulates in the axial symmetry direction, and the efficiency of the reaction cavity is improved. And the in-chip performance uniformity of the reaction cavity is improved.

Description

technical field [0001] The invention relates to semiconductor integrated circuit manufacturing equipment, in particular to a vacuum pumping valve for semiconductor equipment and a vacuum control system using the vacuum pumping valve. Background technique [0002] In the field of semiconductor technology, semiconductor equipment has a huge impact on the yield of wafer manufacturing. With the advent of the era of VLSI, semiconductor wafers have gradually increased from 6 inches and 8 inches to larger sizes such as 12 inches or even 18 inches. As the wafer size continues to increase, wafer fabrication demands more and more semiconductor equipment. The vacuum reaction process chamber is a commonly used reaction chamber in the wafer manufacturing process, and the quality of its vacuum control directly affects the yield of the wafer. [0003] Taking plasma etching as an example, plasma etching (Plasma Etching Technology) performs etching by exciting a plasma formed by an etching...

AI Technical Summary

Problems solved by technology

[0009] The technical problem to be solved by the present invention is to provide a vacuum pumping valve for semiconductor equipment and a vacuum control system with the vacuum pumping valve, which can solve the problems caused by the vacuum pumping direction of the semiconductor device in the cavity vacuum pumping process in the prior art. Eccentricity leads to the problem of non-uniform wafer online size

Images