Integrated thermal shock resistance test device

Abstract

The invention discloses an integrated thermal shock resistance test device, which adopts an integrated box body, a thermal insulation wall dividing the box body into a heating cavity and a cooling cavity is arranged in the box body, and a thermal insulation door is arranged on the thermal insulation wall; intercommunicated sample channels are arranged; a sample channel is blocked or communicated by closing or opening the heat insulation door, and the sample is switched between the hearth and the water tank by adopting the push rod device. The PLC is adopted to control the temperature control box, the winch, the stepping motor and the linear stepping motor, repeated operation of a sample between the hearth and the water tank is achieved, the thermal shock resistance experiment of the refractory material is completed, and the device has the advantages of being compact in structure, closed in testing environment, small in error, small in sample temperature loss, high in test efficiency and the like. The detection accuracy is high; and the automation degree is high.

Description

technical field [0001] The invention relates to the technical field of thermal shock resistance experiments, in particular to an integrated thermal shock resistance test device. Background technique [0002] The ability of a material to withstand rapid changes in temperature without damage is called thermal shock resistance, also known as thermal shock resistance or thermal stability. Thermal shock resistance is an important property of inorganic non-metallic materials, such as ceramics, glass, refractory materials, etc. When the material is suddenly heated to expand or contracted when cooled, internal stress is generated due to the mutual restriction of the deformation of its various parts. When this internal stress exceeds the ultimate strength of the material, cracking, spalling or fracture will occur and lead to failure. In addition to being affected by heat transfer conditions, the thermal shock resistance of a material mainly depends on its thermal expansion coefficie...

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Problems solved by technology

Since the sample is taken out of the furnace by manual operation, and the sample is placed in the cooling medium container, the process of taking the material will take a certain time, and the temperature of the sample to be tested will also decrease accordingly. The detection environment and operation process will affect the extreme point of the sample temperature. , this will reduce the detection accuracy, especially for the parallel test of multiple samples, it is necessary to take out the samples repeatedly, and it is impossible to avoid errors caused by manual operation and environmental changes, so that it is impossible to monitor and unify multiple samples The testing environment leads to poor test repeatability and low detection accuracy.

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