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Red and yellow GaAs series LED chip and preparation method thereof

A LED chip, red and yellow technology, applied in the semiconductor field, can solve the problem of low luminous efficiency of LED chips, achieve the effect of improving the universality and avoiding the overall impact

Pending Publication Date: 2022-05-27
JIANGXI ZHAO CHI SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the object of the present invention is to provide a red-yellow GaAs-based LED chip and its preparation method, aiming to solve the problem of low luminous efficiency of LED chips in the prior art

Method used

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  • Red and yellow GaAs series LED chip and preparation method thereof
  • Red and yellow GaAs series LED chip and preparation method thereof

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Embodiment 1

[0030] see figure 1 , is the red-yellow GaAs-based LED chip provided in the first embodiment of the present invention, the red-yellow GaAs-based LED chip includes a GaAs substrate 1, an epitaxial layer 2, a highly doped GaP layer 3 and a reflective layer 4 that are stacked in sequence, wherein :

[0031] The epitaxial layer 2 includes an N layer 21 , a quantum well layer 22 and a P layer 23 grown in sequence.

[0032] The high-doped GaP layer 3 includes a first carbon-doped GaP layer 31, a second carbon-doped GaP layer 32, a third carbon-doped GaP layer 33, and a fourth carbon-doped GaP layer 34, which are arranged in sequence. On the side close to the epitaxial layer 2, a plurality of transition GaP layers ( not shown).

[0033] By way of example but not limitation, in this embodiment, the carbon doping concentration of the first carbon-doped GaP layer 31 is 3e16cm -3 , the doping concentration of the second carbon-doped GaP layer 32 is 3e17cm -3 , the doping concentrati...

Embodiment 2

[0039] see figure 2 , is a method for preparing a red-yellow GaAs-based LED chip provided in the second embodiment of the present invention, which is used to prepare the LED chip in the above-mentioned first embodiment, and the method includes steps S20-S23:

[0040] Step S20, providing a GaAs substrate;

[0041] Step S21, growing an epitaxial layer on the GaAs substrate;

[0042] By way of example and not limitation, as an embodiment of the epitaxial layer, wherein:

[0043] Grow GaAs as a buffer layer on the GaAs substrate layer;

[0044] Grow GaInP on the buffer layer as a cutoff layer;

[0045] growing GaAs on the cutoff layer as an N-contact layer;

[0046] Growth of GaInP on the N-contact layer as the N-transition layer;

[0047] Growth of AlxGaInP on the N-transition layer as the N-current spreading layer;

[0048] growing N-AlInP on the N-current spreading layer to provide electrons;

[0049] Growth of AlGaInP on the N-AlInP layer as an N-barrier layer;

[005...

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Abstract

The invention provides a red and yellow GaAs system LED chip and a preparation method, the red and yellow GaAs system LED chip comprises a GaAs substrate, an epitaxial layer, a highly-doped GaP layer and a reflecting layer which are sequentially stacked, the highly-doped GaP layer comprises a first carbon-doped GaP layer, a second carbon-doped GaP layer, a third carbon-doped GaP layer and a fourth carbon-doped GaP layer which are sequentially arranged, the first carbon-doped GaP layer is arranged on one side close to the epitaxial layer, the second carbon-doped GaP layer is arranged on the other side close to the epitaxial layer, and the third carbon-doped GaP layer is arranged on the other side close to the fourth carbon-doped GaP layer. A plurality of transition GaP layers are arranged between the first carbon-doped GaP layer and the second carbon-doped GaP layer, a plurality of transition GaP layers are arranged between the second carbon-doped GaP layer and the third carbon-doped GaP layer, the reflecting layer comprises a dielectric layer and a metal mirror surface layer, and the dielectric layer is arranged on one side close to the highly-doped GaP layer. According to the invention, the problem of low luminous efficiency of the LED chip in the prior art is solved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a red-yellow GaAs series LED chip and a preparation method. Background technique [0002] The preparation of the LED mirror surface is an extremely important process in the red-yellow GaAs LED front-mounted reverse polarity vertical structure product. The main purpose is to improve the brightness of the chip through the prepared mirror surface. [0003] When the red-yellow GaAs LED chip MQW (quantum well) emits light, the main application is forward light. Due to the high light absorption properties of GaAs material, the light emitted from the bottom will be absorbed by GaAs and cannot be reflected back to the front. Therefore, the light emitted from the GaAs chip without a mirror layer is mainly forward light. In order to improve the light extraction efficiency and reduce the light absorption, the red and yellow GaAs products have produced a unique front-mounted reverse ...

Claims

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Application Information

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IPC IPC(8): H01L33/00C30B23/02C30B29/40H01L33/30
CPCH01L33/305H01L33/0062C30B23/025C30B29/40
Inventor 窦志珍兰晓雯杨琦贾钊胡加辉金从龙顾伟
Owner JIANGXI ZHAO CHI SEMICON CO LTD