Ceramic heater and method of formation using transient liquid phase bonding
A transient liquid phase and heater technology, applied in ohmic resistance heating, heating element materials, ohmic resistance heating parts, etc., can solve problems affecting heat transfer, poor bonding, cracks or air gaps, etc.
Pending Publication Date: 2022-05-27
WATLOW ELECTRIC MFG
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- Application Information
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Problems solved by technology
However, bonding ceramic materials to metallic materials is known to be difficult due to poor wettability of ceramic materials
Also, when the coefficient of thermal expansion (CTE) of the resistive heating element is incompatible with the CTE of the ceramic substrate, the bond between the ceramic substrate and the resistive heating element may be poorer
That is, cracks or air gaps may be generated at the interface between the ceramic substrate and the resistive heating element, thereby adversely affecting heat transfer from the resistive heating element through the ceramic material to the heating target
Method used
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[0027] The following description is merely exemplary in nature and is not intended to limit the disclosure, application, or uses. It should be understood that throughout the drawings, corresponding reference numerals indicate like or corresponding parts and features. The examples are provided to fully convey the scope of the present disclosure to those skilled in the art. Numerous specific details are set forth, such as types of specific components, devices, and methods, to provide a thorough understanding of variations of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed and that the examples provided herein may include alternative embodiments and are not intended to limit the scope of the present disclosure. In some instances, well-known processes, well-known device structures, and well-known technologies have not been described in detail.
[0028] refer to figure 1 , a ceramic heater 10 constructed in accor...
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Abstract
A heater includes an aluminum nitride (AlN) substrate and a heating layer. The heating layer is made of a molybdenum material and bonded to the AlN substrate by instantaneous liquid phase bonding. The heater may also include a wiring layer and a plurality of first conductive vias connecting the heating layer to the wiring layer. The wiring layer and the plurality of first conductive vias may be made of a molybdenum material and at least one of the wiring layer and the plurality of first conductive vias is bonded to the AlN substrate by transient liquid phase bonding. A plurality of second conductive vias connecting the wiring layer to a surface of the AlN substrate may be included and the plurality of second conductive vias are made of a molybdenum material and may be bonded to the AlN substrate by transient liquid phase bonding.
Description
[0001] CROSS-REFERENCE TO RELATED APPLICATIONS [0002] This application claims priority to US Provisional Application No. 62 / 899,189, filed on September 12, 2019. The disclosures of the aforementioned applications are incorporated herein by reference. technical field [0003] The present disclosure relates to resistance heaters and, more particularly, to ceramic heaters having resistance heating elements with ceramic substrates. Background technique [0004] The statements in this section merely provide background information related to the present disclosure and should not constitute prior art. [0005] A typical ceramic heater typically includes a ceramic substrate and a resistive heating element embedded in or disposed on the ceramic substrate. Due to the excellent thermal conductivity of the ceramic material, the heat generated by the resistive heating element can be quickly transferred to the heating target placed close to the ceramic substrate. However, bonding cer...
Claims
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IPC IPC(8): H05B3/26H05B3/14H05B3/12H05B3/28H05B1/02H01L21/67
CPCH05B3/265H05B3/143H05B3/12H05B3/283H05B1/0233H01L21/67103H05B2203/005H05B2203/016H05B2203/017H01L21/68757H05B3/03B23K2103/18B23K2103/10B23K2101/40B23K20/02C04B35/581C04B37/023C04B2237/122C04B2237/16C04B2237/366C04B2237/62
Inventor 帕特里克·马加维奥托德·布鲁克库尔特·英格利希
Owner WATLOW ELECTRIC MFG