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Packaging adhesive film

A technology of encapsulation film and transparent encapsulant, which is applied in the direction of adhesive, film/sheet without carrier, film/sheet adhesive, etc., can solve the problem of high hardness of the encapsulation film, and reduce the density and hardness. , Conducive to the effect of lightweight

Pending Publication Date: 2022-05-31
HANGZHOU FIRST APPLIED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The embodiment of the present application provides an encapsulation film to solve the problem of high hardness of the encapsulation film in the prior art, reduce the probability of cracks in the cells during the encapsulation process of photovoltaic modules, and improve the encapsulation qualification rate and service life of photovoltaic modules

Method used

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Examples

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Embodiment 1

[0053] As shown in FIG. 1, an encapsulation film 100, specifically a transparent encapsulation film, is only composed of a cell layer 11. Cells

Embodiment 2

[0055] As shown in FIG. 1, an encapsulation film 100 is specifically a transparent encapsulation film. In addition to the encapsulation film prepared

Embodiment 3

[0057] As shown in FIG. 1, an encapsulation film 100 is specifically a transparent encapsulation film. The foamed layer is the same as in Example 1, but

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PUM

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Abstract

The invention belongs to the technical field of photovoltaic packaging. The invention discloses a packaging adhesive film, which is used for bonding a battery piece and a photovoltaic substrate of a photovoltaic module, and comprises a foam hole layer. The foam hole layer comprises a base body and foam holes distributed in the base body. The raw material of the foam layer comprises matrix resin, the shore hardness of the foam layer is less than or equal to 80HA, and the storage modulus of the foam layer at 23 DEG C is less than or equal to 15MPa. The photovoltaic module packaging adhesive film is mainly applied to photovoltaic module packaging, the problems that the packaging adhesive film is large in hardness, and the phenomenon of subfissure of a battery piece is prone to occurring in the laminating process are solved, and the qualified rate of photovoltaic module packaging can be improved.

Description

A packaging film technical field [0001] The present invention belongs to the technical field of photovoltaic packaging, in particular to a packaging film. Background technique [0002] The main component of the solar photovoltaic cell assembly is the solar cell, and the solar cell cannot be directly exposed Under natural conditions such as sunlight and rain, it is necessary to encapsulate solar cells in practical applications. The encapsulation film is an important packaging material in photovoltaic packaging, and the encapsulation film bonds photovoltaic cells and photovoltaic glass and The backplane protects the cells and encapsulates them into photovoltaic modules that can output direct current. Because the packaging process of photovoltaic modules has Inverse, and the operating life of photovoltaic modules is required to be more than 25 years, once the film of photovoltaic modules begins to yellow, crack, light Volt components are very easy to fail and be scrapp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/30C09J7/10C09J123/08C09J123/16
CPCC09J7/30C09J7/10C09J2203/322C09J2423/04C09J2301/208Y02E10/50
Inventor 郑炯洲魏梦娟侯宏兵
Owner HANGZHOU FIRST APPLIED MATERIAL CO LTD
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