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Photosensitive composition

A technology of photosensitive composition and photoinitiator, applied in the field of photosensitive composition, can solve problems such as troublesome, inconvenient handling, and reduced mechanical quality of relief structure

Pending Publication Date: 2022-05-31
恩熙思德国有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing precursors often lead to relief structures showing undesired features after development
Those relief structures suffer from a reduction in mechanical quality and often show cracks or other deformations, especially when one works with them or prints for a longer period of time
In addition, the side edges of relief precursors and relief structures have a tendency to curl, which is rather cumbersome and inconvenient to handle

Method used

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  • Photosensitive composition
  • Photosensitive composition
  • Photosensitive composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0230] In this example, it is demonstrated that ethylenically unsaturated monomers as component E which comprise ionic groups according to the invention achieve improved AOX values ​​or EOX values ​​or both. AOX values ​​are shown in Table 1.

[0231]

[0232] Table 1

[0233] (HPPE) and (BHPD) contain 2-hydroxy-3-phenoxypropylprop-2-enoate and 1,4-butanediylbis[oxy(2-hydroxy-3,1-propanedi base)] diacrylate, and represents an acrylate commonly used in industry as a comparative example, such a component does not have an ionic group and represents the component EM.

[0234] TMAEMC, MAPTAC, ADAMQUAT, Na-AMPS have ionic groups and represent component E of the invention.

[0235] In fact, the selected ethylenically unsaturated monomers lead to more desirable AOX values ​​and / or EOX values. These values ​​have been measured or determined according to measurement methods as further described herein.

[0236] Measurement of AOX of ethylenically unsaturated monomers (component...

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Abstract

The invention relates to a photosensitive composition. A photosensitive composition of a developable relief precursor, the photosensitive composition comprising: as component E, at least one ethylenically unsaturated monomer; at least one photoinitiator or photoinitiator system as component P; at least one water-soluble and / or water-dispersible binder as component B; optionally, one or more additives as component A wherein component E comprises at least one ionic group and component E is present in an amount of 0.1 wt% to 30 wt% based on the total weight of the photosensitive composition.

Description

technical field [0001] The field of the invention relates to a developable relief precursor photosensitive composition and the resulting compositions for flexographic printing, pad printing and letterpress printing relief structure. Background technique [0002] In the fields of pad printing, flexographic printing and letterpress printing, developable printing plates, also called relief precursors, are produced and developed in order to produce relief structures with the desired patterned surface. The patterned surface is then covered with ink and pressed against the printing substrate. In this way, one can transfer ink and produce desired images on printed substrates such as packaging, labels, paper rolls, polymer films, cardboard, and many other products. [0003] Relief precursors generally comprise photosensitive compositions in which the components crosslink or cure when they are exposed to electromagnetic radiation. During exposure, the precursor is exposed to elect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/033
CPCG03F7/033G03F7/028G03F7/027G03F7/0045G03F7/0392G03F7/20G03F7/322
Inventor 托马斯·保勒尔C·皮奇
Owner 恩熙思德国有限公司