PCB solder resist ink performance test method

A technology of solder resist ink and testing method, which is applied in the direction of material inspection products, etc., can solve the problems of selection of solder resist ink production and processing, disadvantages, etc., and achieve the effect of complete test items and accurate performance test

Pending Publication Date: 2022-06-03
江苏可信电子材料有限公司
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a method for testing the performance of PCB solder resist ink, which effectively solves the problem that it is not conducive to selecting a suitable solder resist ink for production and processing according to requirements.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Embodiment 1, a method for testing the performance of PCB solder resist ink according to the present invention includes the following steps: substrate treatment, material opening, coating, pre-baking, exposure, development, secondary hardening, and anti-oxidation treatment;

[0022] Substrate treatment: uniformly cut the plate into substrates of the same size, then open positioning holes at the edge of the substrate, and finally perform surface pickling, surface grinding, water washing and drying on the substrate in sequence;

[0023] Open the material; add the curing agent to the solder mask ink, in which the solder mask ink accounts for 75%, add an appropriate amount of diluent, stir or shake for 5 minutes, so that the solder mask ink is fully mixed evenly, and apply different curing agents to different substrates Proportion of solder mask ink for hardness test comparison;

[0024] Coating; use an ink coating wheel to evenly coat the solder resist ink layer on the sur...

Embodiment 2

[0035] Embodiment 2, a method for testing the performance of PCB solder resist ink according to the present invention includes the following steps: substrate treatment, material opening, coating, pre-baking, exposure, development, secondary hardening, and anti-oxidation treatment;

[0036] Substrate treatment: uniformly cut the plate into substrates of the same size, then open positioning holes at the edge of the substrate, and finally perform surface pickling, surface grinding, water washing and drying on the substrate in sequence;

[0037] Open the material; add the curing agent to the solder mask ink, of which the solder mask ink accounts for 85%, add an appropriate amount of diluent, stir or shake for 10 minutes, so that the solder mask ink is fully mixed evenly, and apply different curing agents to different substrates Proportion of solder mask ink for hardness test comparison;

[0038] Coating; use an ink coating wheel to evenly coat the solder resist ink layer on the su...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of solder resist ink performance testing, and discloses a PCB solder resist ink performance testing method. The PCB solder resist ink performance test method comprises the following steps of substrate treatment, cutting, coating, pre-baking, exposure, development, secondary hardening and antioxidant treatment. Processing the substrate; according to the technical scheme, the plate is evenly cut into the base plates with the same size, then positioning holes are formed in the edge positions of the base plates, and finally the base plates are sequentially subjected to surface acid pickling, surface polishing and brushing, water washing treatment and drying. The plurality of substrates are used for experimental data collection and experimental operation, so that test items in one-time test are more sound, the performance test of the solder resist ink is more accurate, and proper solder resist ink can be selected according to requirements.

Description

technical field [0001] The invention belongs to the technical field of solder resist ink performance testing, in particular to a method for testing the properties of PCB solder resist ink. Background technique [0002] PCB board, also known as printed circuit board, printed circuit board, or printed circuit board for short, is cut into a certain size with an insulating board as the base material, and at least one conductive pattern is attached to it, and holes are arranged on it. The surface is covered with a layer of solder resist cured film, which acts as an insulation on the circuit board and is used to protect the circuit in the circuit board. [0003] The current performance evaluation test for solder mask ink in the PCB industry is not perfect, and most of them use scrap boards or a single test module for performance evaluation. Because the evaluation test items are perfect, it is not conducive to select suitable solder mask ink for production and processing according ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01N33/32
CPCG01N33/32
Inventor 樊宏伟夏芸蒋乃君
Owner 江苏可信电子材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap